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Reliability of Dielectric Barrier Films in Copper Damascene Applications

Published online by Cambridge University Press:  17 March 2011

Albert S. Lee
Affiliation:
Dielectric Systems & Modules Product Business Group Applied Materials Inc., Santa Clara, CA 95054, U.S. A
Annamalai Lakshmanan
Affiliation:
Dielectric Systems & Modules Product Business Group Applied Materials Inc., Santa Clara, CA 95054, U.S. A
Nagarajan Rajagopalan
Affiliation:
Dielectric Systems & Modules Product Business Group Applied Materials Inc., Santa Clara, CA 95054, U.S. A
Zhenjiang Cui
Affiliation:
Dielectric Systems & Modules Product Business Group Applied Materials Inc., Santa Clara, CA 95054, U.S. A
Maggie Le
Affiliation:
Dielectric Systems & Modules Product Business Group Applied Materials Inc., Santa Clara, CA 95054, U.S. A
Li Qun Xia
Affiliation:
Dielectric Systems & Modules Product Business Group Applied Materials Inc., Santa Clara, CA 95054, U.S. A
Bok Heon Kim
Affiliation:
Dielectric Systems & Modules Product Business Group Applied Materials Inc., Santa Clara, CA 95054, U.S. A
Hichem M'Saad
Affiliation:
Dielectric Systems & Modules Product Business Group Applied Materials Inc., Santa Clara, CA 95054, U.S. A
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Abstract

The film properties of two PECVD deposited dielectric copper barrier films have been optimized to improve BEOL device reliability in terms of electromigration. Two critical aspects that affect electromigration are the dielectric barrier film hermeticity and adhesion to copper. We use a method to quantify the barrier film hermeticity and have optimized the hermeticity of the BLOκ™ low-κ dielectric barrier film to be similar to that of silicon nitride. By using FT-IR we find that the film porosity has a much stronger effect than the film stoichiometry on hermeticity. In addition, the interfaces between Damascene Nitride™ with copper, as well as BLOκ with copper have been engineered to improve the interfacial adhesion energy to >10 J/m2 for both Damascene Nitride and BLOκ.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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