"The most advantageous feature of the ex-situ lift out method is throughput."

A great deal of emphasis is placed on "throughput" in the microprocessor industry. Wafer sizes are getting larger and the costs of building them have increased astronomically. The transmission electron microscope (TEM) has become the essential tool for examining current microprocessor products. The TEM can only be effective if it has properly prepared specimens to put into it. In order to achieve the highest specimen preparation spatial resolution, the microprocessor industry has turned to focused ion beam (FIB) tools, either single or dual column, for TEM specimen preparation in applications ranging from process control to failure analysis, and on to semiconductor device metrology.