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Robust Measurements of Functional Material Properties using in situ 4D-STEM

Published online by Cambridge University Press:  22 July 2022

Colin Ophus*
Affiliation:
NCEM, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA, USA
Michele Conroy
Affiliation:
Department of Materials, Imperial College London, London, UK .
Mohsen Danaie
Affiliation:
Electron Physical Science Imaging Centre (ePSIC), Diamond Light source, Didcot, UK
Benjamin H Savitzky
Affiliation:
NCEM, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA, USA
Alexander Rakowski
Affiliation:
NCEM, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA, USA
Abigail Ackerman
Affiliation:
Department of Materials, Imperial College London, London, UK .
Steven E Zeltmann
Affiliation:
Department of Materials Science and Engineering, University of California, Berkeley, CA, USA
Jim Ciston
Affiliation:
NCEM, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA, USA
Andrew M Minor
Affiliation:
NCEM, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA, USA Department of Materials Science and Engineering, University of California, Berkeley, CA, USA
David Dye
Affiliation:
Department of Materials, Imperial College London, London, UK .

Abstract

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Type
Insights into Phase Transitions in Functional Materials by In Situ/Operando TEM: Experiment Meets Theory
Copyright
Copyright © Microscopy Society of America 2022

References

Ophus, C, Microscopy and Microanalysis 25 (2019), p. 563.Google Scholar
Savitzky, BH et al. , Microscopy and Microanalysis 27 (2021), p. 712.Google Scholar
Ophus, C et al. , accepted to Microscopy and Microanalysis, preprint arXiv:2111.00171 (2022).Google Scholar
Munshi, J et al. , arXiv:2202.00204 (2022).Google Scholar
Zeltmann, SE et al. , Ultramicroscopy 209 (2020), 112890.10.1016/j.ultramic.2019.112890CrossRefGoogle Scholar
Work at the Molecular Foundry was supported by the Office of Science, Office of Basic Energy Sciences, of the U.S. Department of Energy under Contract No. DEAC02-05CH11231.Google Scholar