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Thermally induced damages of PECVD SiNx thin films

Published online by Cambridge University Press:  25 August 2011

Yinong Liu ,
Neerushana Jehanathan  and
John Dell
Yinong Liu*
Affiliation:
School of Mechanical and Chemical Engineering, The University of Western Australia, Crawley, Western Australia 6009, Australia
Neerushana Jehanathan
Affiliation:
School of Mechanical and Chemical Engineering, The University of Western Australia, Crawley, Western Australia 6009, Australia
John Dell
Affiliation:
School of Electrical, Electronic and Computer Engineering, The University of Western Australia, Crawley, Western Australia 6009, Australia
*
a)Address all correspondence to this author. e-mail: liu@mech.uwa.edu.au
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Abstract

This study investigates thermally induced structural damages to amorphous plasma-enhanced chemical vapor deposition (PECVD) SiNx thin films at elevated temperatures, including chemical structure, microstructure, and physical integrity. The films were synthesized by means of PECVD method. Heating to elevated temperatures in air was found to cause multiple forms of chemical, structural, and physical damages. Chemically the films were found to oxidize and lose their nitrogen and hydrogen contents. Structurally the amorphous SiNx matrix was found to convert partially into SiO2 as a result of oxidation and to crystallize into Si3N4 crystallites. The physical damages include pinholes, circular “penny” cracks, random “dry mud” cracks, and spalling. The types of the damages were observed in different temperature regimes. The formation of the penny cracks is attributed to excessive compressive stresses created in the film by oxidation, which is associated with a large volume expansion. The formation of the random cracks is attributed to tensile stresses caused by crystallization, which is associated with a large volume contraction. Such damages limit the suitable application conditions for devices made of these films.

Keywords

Thin filmNitrideSi
Type
Articles
Information
Journal of Materials Research , Volume 26 , Issue 19 , 14 October 2011 , pp. 2552 - 2557
Copyright
Copyright © Materials Research Society 2011

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