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Thermal properties of nanocrystalline Al composites reinforced by AlN nanoparticles

Published online by Cambridge University Press:  31 January 2011

Y.Q. Liu ,
H.T. Cong  and
H.M. Cheng
Y.Q. Liu
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People's Republic of China
H.T. Cong*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People's Republic of China
H.M. Cheng
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People's Republic of China
*
a)Address all correspondence to this author. e-mail: htcong@imr.ac.cn
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Abstract

To explore potential applications of nanocomposites for microelectronic packaging, the thermal properties were investigated on newly developed nanocrystalline Al composites reinforced by AlN nanoparticles. It was found that the thermal conductivity (TC) is reduced with increasing AlN volume fraction (Vp), since connectivity of Al matrix is decreased by introduction of the nanoparticles. Although AlN nanoparticles introduce thermal resistance, they still have significant contribution to the TC of the composite as high-TC inclusion. Particularly, a percolation behavior of AlN nanoparticles is thought to occur with the threshold at 23–30%. Measurements at elevated temperatures (∼500 °C) show almost no distinct degradation of TC relative to room temperature. Moreover, the coefficient of thermal expansion (CTE) is remarkably lowered as Vp increases, e.g., from 26 × 10−6 to 13.9 × 10−6 K−1, by raising Vp to 39%. Therefore, the nanocomposites may be applicable as electronic packaging material, due to the combination of acceptable TC and low CTE.

Keywords

CompositeNanostructureThermal conductivity
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 1 , January 2009 , pp. 24 - 31
Copyright
Copyright © Materials Research Society 2009

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