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Suppression of pyrochlore phase formation in Sr0.7Bi2.4Ta2O9 thin films using nanoseed layer

Published online by Cambridge University Press:  31 January 2011

Se-Yeon Jung
Affiliation:
Department of Materials Science & Engineering, Daejin University, Pochun-koon, Kyunggi-do 487-711, Korea
Seung-Joon Hwang
Affiliation:
Department of Materials Science & Engineering, Daejin University, Pochun-koon, Kyunggi-do 487-711, Korea
Yun-Mo Sung
Affiliation:
Department of Materials Science & Engineering, Daejin University, Pochun-koon, Kyunggi-do 487-711, Korea
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Abstract

A Sr0.7Bi2.4Ta2O9 (SBT) seed layer approximately 40 nm thick was formed on Pt/Ti/SiO2/Si substrates, and SBT thin films with the same chemical composition were deposited on the substrates with and without seed layer using sol-gel and spin coating methods. The influence of seed layer on the phase formation characteristics of SBT thin films was investigated using x-ray diffraction and scanning electron microscopy analyses. Formation of pyrochlore as well as Aurivillius phase was observed in both the unseeded and seeded SBT films heated at 740 °C. However, it was revealed that Aurivillius phase formation was enhanced in seeded SBT thin films and pyrochlore phase formation was highly suppressed. In this study, two possible mechanisms for the suppression of pyrochlore phase formation were proposed from the perspectives of activation energy difference between Aurivillius and pyrochlore phase formation, and Bi-ion diffusion to pyrochlore phase.

Type
Rapid Communications
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

Araujo, C.A.P., Cuchiaro, J.D., McMillan, L.D., Scott, M.C., Scott, J.F., Nature 347, 627 (1995).CrossRefGoogle Scholar
Desu, S.B. and Li, T.K., Mater. Sci. Eng. B 34, L4 (1995).CrossRefGoogle Scholar
Kwak, W-C. and Sung, Y-M., J. Mater. Res. 17, 1463 (2002).CrossRefGoogle Scholar
Kato, K., Zheng, C., Finder, J.M., and Dey, S.K., J. Am. Ceram. 81, 1869 (1999).CrossRefGoogle Scholar
Zhou, Q.F., Chan, H.L.W., and Choy, L.L., J. Non-Cryst. Solids 254, 106 (1999).CrossRefGoogle Scholar
Rodriguez, M.A., Boyle, T.J., Hernandez, B.A., Buchheit, C.D., and Eatough, M.O., J. Mater. Res. 11, 2282 (1996).CrossRefGoogle Scholar
Lee, S-H., Lee, J-K., and Yoon, K.H., J. Mater. Res. 17, (2002) 1455.CrossRefGoogle Scholar
Kumagai, M. and Messing, G.L., J. Am. Ceram. Soc. 68, 500 (1985).CrossRefGoogle Scholar
Wu, A., Salvado, I.M.M., Vilarinho, P.M., and Baptista, J.L., J. Eur. Ceram. Soc. 17, 1443 (1997).CrossRefGoogle Scholar
Narendar, Y. and Messing, G.L., J. Am. Ceram. Soc. 82, 1659 (1999).CrossRefGoogle Scholar
Sung, Y-M., Anilkumar, G.M., and Hwang, S-J., J. Mater. Res. 18, 387 (2003).CrossRefGoogle Scholar
Shimakawa, Y., Kubo, Y., Nakagawa, Y., Kamiyama, T., Asano, H., and Izumi, F., Appl. Phys. Lett. 74, 1904 (1999).CrossRefGoogle Scholar