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Stable, highly concentrated suspensions for electronic and ceramic materials applications

Published online by Cambridge University Press:  31 January 2011

I. Sushumna
Affiliation:
Department of Chemical Engineering, State University of New York at Buffalo, Buffalo, New York 14260
R.K. Gupta
Affiliation:
Department of Chemical Engineering, State University of New York at Buffalo, Buffalo, New York 14260
E. Ruckenstein*
Affiliation:
Department of Chemical Engineering, State University of New York at Buffalo, Buffalo, New York 14260
*
b)Address correspondence to E. Ruckenstein.
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Abstract

Highly concentrated solid-in-liquid suspensions find applications in a number of areas such as electronics, ceramics, paints, coatings, etc. Highly loaded, stable suspensions which exhibit desirable rheological characteristics (moderate viscosity, shear thinning behavior, thixotropy, and a small yield stress, for example), and which have high thermal or electrical conductivities are frequently sought after. We describe here some techniques which can be used to obtain such highly concentrated suspensions. These involve employing mixed size grades of particles and effective dispersants. For thermal paste applications, for example, compliant pastes of up to 78 vol. % solids with thermal conductivity values as high as 6 W/mK (hence, a few times greater than the values reported previously by others), low electrical conductivity, and moderate viscosity have been prepared by mixing different particle size grades of materials such as Al2O3, SiC, AlN, Al, and diamond. Effective dispersants, both commercial as well as those synthesized in our laboratory as novel variations of previously known molecular architectures, have been used to facilitate the achievement of these very high loading and stable suspensions.

Type
Articles
Copyright
Copyright © Materials Research Society 1991

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