Hostname: page-component-5c6d5d7d68-tdptf Total loading time: 0 Render date: 2024-08-16T13:29:24.880Z Has data issue: false hasContentIssue false

Solvent-induced damage in polyimide thin films

Published online by Cambridge University Press:  31 January 2011

M.S. Hu
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, California 93106
M.Y. He
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, California 93106
A.G. Evans
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, California 93106
Get access

Abstract

Solvent induced crazes formed in strained polyimide thin films on different substrates have been studied. A fracture mechanics approach has been used to simulate craze evolution. The experiments and simulations have identified a critical prestrain below which craze formation does not occur. This strain decreases with increase in solvent exposure time, but also exhibits a threshold. Diffusion of the solvent into the film is considered to be responsible for the time-dependent nature of damage formation.

Type
Articles
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Yang, A. C. M. and Brown, H. R., J. Mater. Sci. 23, 65 (1988).CrossRefGoogle Scholar
2.Brown, H. R. and Yang, A. C. M., J. Mater. Sci. 25, 2866 (1990).CrossRefGoogle Scholar
3.Neuhaus, H. J. (private communication).Google Scholar
4.Kramer, E. J. and Bubeck, R. A., J. Polymer Sci.—Polymer Phys. 16, 1195 (1978).CrossRefGoogle Scholar
5.Tonyali, K. and Brown, H. R., J. Mater. Sci. 21, 3116 (1986).CrossRefGoogle Scholar
6.Chan, M. K. V. and Williams, J. G., Polymer 24, 234 (1983).CrossRefGoogle Scholar
7.Verhuelpen-Heymans, N. and Bauwens, J. C., J. Mater. Sci. 11, 7 (1976).CrossRefGoogle Scholar
8.Williams, J. G. and Marshall, G. P., in Mechanisms of Environment- Sensitive Cracking of Materials, Proc. Int. Conf., University of Surrey, April 1977, edited by Swann, P. R., Ford, R. P., and Westwood, A. R. C. (The Metals Society, London, 1977), p. 237.Google Scholar
9.Harper, B. D. (to be published).Google Scholar
10.Farris, R. J., Sackinger, S. R., Maden, M. A., and Ho, S., Final Report on SUR IBM Contract (1989).Google Scholar
11.Argon, A. S. and Hannoosh, J. G., Philos. Mag. 36, 1195 (1977).CrossRefGoogle Scholar
12.Kambour, R. P., Encyclopaedia of Polymer Sci. and Technol. 4, 308 (1985).Google Scholar
13.Kramer, E. J., in Developments in Polymer Fracture, edited by Andrews, E. H. (Applied Sci. Publisher, London, 1979), Chap. 3.Google Scholar
14.Hu, M. S. and Evans, A. G., Acta Metall. 137, 917 (1989).CrossRefGoogle Scholar
15.Beuth, J. (to be published).Google Scholar
16.He, M. Y. and Evans, A. G. (to be published).Google Scholar
17.Raju, I. S. and Newman, J. C., Jr., Eng. Frac. Mech. 11, 817 (1979).CrossRefGoogle Scholar
18.Handbook of Stress Intensity Factors, edited by Sih, G. C. (Lehigh Univ. Press, Bethlehem, PA, 1987).Google Scholar
19.Ho, P. S., in Principles of Electronic Packaging, edited by Seraphim, D. P., Lasky, R. C., and Li, C. Y. (McGraw-Hill, New York, 1989), p. 824.Google Scholar