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Role of friction and loading parameters in four-point bend adhesion measurements

Published online by Cambridge University Press:  31 January 2011

David M. Gage ,
Kyunghoon Kim ,
Christopher S. Litteken  and
Reinhold H. Dauskardt
David M. Gage
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305-2205
Kyunghoon Kim
Affiliation:
Department of Mechanical Engineering, Stanford University, Stanford, California 94305-2205
Christopher S. Litteken
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305-2205
Reinhold H. Dauskardt*
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, California 94305-2205
*
a)Address all correspondence to this author. e-mail: dauskardt@stanford.edu
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Abstract

The effects of salient testing parameters on four-point adhesion measurements of thin-film structures on silicon substrates were systematically studied. These included specimen geometry, applied displacement rate, and load point separation. Measured fracture energy values, Gc, were observed to increase as the ratio of applied moment arm to specimen thickness was decreased beyond a value of ∼4, particularly for specimens with Gc > 5 J/m2. Testing parameters that affect the steady-state crack velocity were also found to affect reported Gc values. The resulting trends in Gc values are shown to be related to loading-point friction and environmentally assisted cracking effects. Good practice testing guidelines are suggested to improve the accuracy and precision of four-point bend measurements.

Keywords

AdhesionThin filmFracture
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 1 , January 2008 , pp. 87 - 96
Copyright
Copyright © Materials Research Society 2008

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References

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