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Numerical study on the measurement of thin film mechanical properties by means of nanoindentation

Published online by Cambridge University Press:  31 January 2011

Xi Chen  and
Joost J. Vlassak
Xi Chen
Affiliation:
Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
Joost J. Vlassak*
Affiliation:
Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
*
a)Address all correspondence to this author.vlassak@esag.harvard.edu
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Abstract

Nanoindentation is a technique commonly used for measuring thin film mechanical properties such as hardness and stiffness. In this study, we used the finite element method to investigate the effect of substrate and pileup on hardness and stiffness measurements of thin film systems. We define a substrate effect factor and construct a map that may be useful in the interpretation of indentation measurements when it is not possible to make indentations shallow enough to avoid the influence of the substrate on the measurements. A new technique for measuring mechanical properties of thin films by nanoindentation is suggested at the end of this article.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 10 , October 2001 , pp. 2974 - 2982
Copyright
Copyright © Materials Research Society 2001

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