Hostname: page-component-848d4c4894-pftt2 Total loading time: 0 Render date: 2024-05-21T04:03:38.727Z Has data issue: false hasContentIssue false
  • English
  • Français

Microstructure and mechanical strength of diffusion-bonded Ti3SiC2/Ni joints

Published online by Cambridge University Press:  03 March 2011

X.H. Yin ,
M.S. Li  and
Y.C. Zhou
X.H. Yin
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China and Graduate School of Chinese Academy of Sciences, Beijing 100039, China
M.S. Li*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Y.C. Zhou
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
*
a) Address all correspondence to this author. E-mail: mshli@imr.ac.cn
Get access

Abstract

Diffusion bonding of Ti3SiC2 and nickel has been conducted at temperatures of 800 °C–1100 °C for 10–90 min under 6–20 MPa in a vacuum. The phase composition and microstructure of the joints were investigated by X-ray diffraction, scanning electron microscopy, and electron probe microanalysis. The total diffusion path of the joining is determined to be Ni/Ni31Si12 + Ni16Ti6Si7 + TiCx/Ti3SiC2 + Ti2Ni + TiCx/ Ti3SiC2. The growth of the reaction layer follows parabolic law, and the temperature dependence of the reaction constant, k, can be expressed as k = 1.68 × 10−4 exp(−118 ± 12 kJ/RT) m/s1/2. The diffusion of nickel through the reaction zone toward Ti3SiC2 is the main controlling step in the bonding process. Joint strengths were determined through shear tests. The maximum shear strength of 121 ± 7 MPa, which is close to the shear strength of Ti3SiC2, has been obtained under the condition of 1000 °C for 10 min under 20 MPa.

Keywords

BondingCeramicDiffusion
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 9 , September 2006 , pp. 2415 - 2421
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Barsoum, M.W.: The MN + 1AXN phases: A new class of solids: Thermodynamically stable nanolaminates. Prog. Solid Chem. 28, 201 (2000).Google Scholar
2Zhou, Y.C. and Sun, Z.M.: Microstructure and mechanism of damage tolerance for Ti3SiC2 bulk ceramics. Mater. Res. Innov. 2, 360 (1999).CrossRefGoogle Scholar
3Gao, N.F., Miyamoto, Y., and Zhang, D.: Dense Ti3SiC2 prepared by reactive HIP. J. Mater. Sci. 34, 4385 (1999).CrossRefGoogle Scholar
4Barsoum, M.W. and El-Raghy, T.: Synthesis and characterization of a remarkable ceramic: Ti3SiC2. J. Am. Ceram. Soc. 79, 1953 (1996).Google Scholar
5El-Raghy, T., Zavaliangos, A., Barsoum, M.W., and Kalidindi, S.R.: Damage mechanisms around hardness indentation in Ti3SiC2. J. Am. Ceram. Soc. 80, 513 (1997).CrossRefGoogle Scholar
6Zhou, Y.C., Sun, Z.M., and Yu, B.H.: Microstructure of Ti3SiC2 prepared by the in situ hot pressing/solid-liquid reaction process. Z. Metallkd. 91, 937 (2000).Google Scholar
7El-Raghy, T., Barsoum, M.W., Zavaliangos, A., and Kalidindi, S.R.: Processing and mechanical properties of Ti3SiC2: II. Effect of grain size and deformation temperature. J. Am. Ceram. Soc. 82, 2855 (1999).CrossRefGoogle Scholar
8Sun, Z.M., Zhou, Y.C., and Li, M.S.: High temperature oxidation behavior of Ti3SiC2-based material in air. Acta Mater. 49, 4347 (2001).CrossRefGoogle Scholar
9Loehman, R.E. and Tomsia, A.P.: Joining of ceramics. Am. Ceram. Soc. Bull. 67, 375 (1988).Google Scholar
10Gao, N.F. and Miyamoto, Y.: Joining of Ti3SiC2 with Ti-6Al-4V. J. Mater. Res. 17, 52 (2002).CrossRefGoogle Scholar
11Fernie, J.A., Threadgill, P.L., and Waston, M.N.: Progress in joining of advanced materials. Weld. Metal Fabrication 5, 179 (1991).Google Scholar
12Maloletov, M.P., Kazakov, V.A., and Kudryashov, O.N.: Electron beam welding ceramics based on titanium nitride with metals. Weld. Int. 7, 476 (1993).Google Scholar
13Pedraza, A.J.: Metal-ceramic bonding by pulsed laser processing. Mater. Manuf. Process 8, 239 (1993).Google Scholar
14Reuter, M. and Roeder, E.: Ultrasonic welding of glass and glass-ceramic to metal. Weld. Cut. 4, E62 (1993).Google Scholar
15Matsuoka, S.: Ultrasonic welding of ceramic/metal. J. Mater. Pro. Technol. 47, 185 (1994).Google Scholar
16Hlavacek, V.: Combustion synthesis: A historical perspective. Ceram. Bull. 70, 240 (1991).Google Scholar
17Miyamoto, Y., Nakamoto, T., Koizumi, M., and Yamauda, O.: Ceramic-to-metal welding by a pressurized combustion reaction. J. Mater. Res. 1, 7 (1986).CrossRefGoogle Scholar
18Kim, S.T. and Kim, C.H.: Interfacial reaction product and its effect on the strength of copper to alumina eutectic bonding. J. Mater. Sci. 27, 2061 (1992).Google Scholar
19Elsawy, A.H. and Fahmy, M.F.: Brazing of Si3N4 ceramic to copper. J. Mater. Pro. Technol. 77, 266 (1998).Google Scholar
20Kim, J.H. and Yoo, Y.C.: Bonding of alumina to metal with Mg-Cu-Zr brazing alloy. J. Mater. Sci. Lett. 16, 1212 (1997).CrossRefGoogle Scholar
21Backhaus-Ricoult, M.: Solid-state reaction between silicon carbide and (Fe,Ni,Cr)-alloy: Reaction paths, kinetics and morphology. Acta Metall. Mater. 40, S95 (1992).Google Scholar
22Naka, M., Feng, J.C., and Schuster, J.C.: Phase reaction and diffusion path of the SiC/Ti system. Metall. Mater. Trans. 28, 1385 (1997).CrossRefGoogle Scholar
23Fukai, T., Naka, M., Shibayanagi, T., and Shuster, J.C.: Interfacial structure and bond strength of solid state bonded SiC/Ni joints. Trans. JWRI 26, 27 (1997).Google Scholar
24Bhanumuthy, K. and Schmid-Fetzer, R.: Interface reaction between silicon carbide and metals (Ni, Cr, Pd, Zr). Composites Part A 32, 569 (2001).Google Scholar
25Osendi, M.I., De Pablos, A., and Miranzo, P.: Microstructure and mechanical strength of Si3N4/Ni solid-state bond interface. Mater. Sci. Eng., A 308, 53 (2001).CrossRefGoogle Scholar
26Nakamura, M., Shigematsu, I., Kanayama, K., and Hirai, Y.: Joining of Si3N4 ceramic with nickel and Ni-Cr alloy laminated interlayers. J. Mater. Sci. Lett. 12, 716 (1993).Google Scholar
27Zhou, Y.C., Sun, Z.M., Chen, S.Q., and Zhang, Y.: In situ hot pressing/solid-liquid reaction synthesis of dense titanium silicon carbide bulk ceramics. Mater. Res. Innov. 2, 142 (1998).CrossRefGoogle Scholar
28Martinelli, A.E. and Drew, R.A.L.: Microstructure and mechanical strength of diffusion-bonded silicon nitride-molybdenum joints. J. Eur. Ceram. Soc. 19, 2173 (1999).CrossRefGoogle Scholar
29El-Raghy, T. and Barsoum, M.W.: Diffusion kinetics of the carburization and silicidation in Ti3SiC2. J. Appl. Phys. 83, 225 (1998).Google Scholar
30Wan, D.T., Zhou, Y.C., Hu, C.F., and Bao, Y.W.: Improved strength: impairing contact damage resistance of Ti3Si(Al)C2/SiC composites. J. Eur. Ceram. Soc. (in press).Google Scholar
31Jeitschko, W. and Nowotny, H.: The crystal structure of Ti3SiC2—a new complex carbide. Monatshefte fur Chemie 98, 329 (1967).CrossRefGoogle Scholar
32Barsoum, M.W., El-Raghy, T., Farber, L., Amer, M., Christini, R., and Adams, A.: The toptaxial transformation of Ti3SiC2 to form a partially ordered cubic TiC0.67 phase by the diffusion of Si into molten cryolite. J. Electrochem. Soc. 146, 3919 (1999).CrossRefGoogle Scholar
33El-Raghy, T., Barsoum, M.W., and Sika, M.: Reaction of Al with Ti3SiC2 in the 800-1000 °C temperature range. Mater. Sci. Eng., A 298, 174 (2001).CrossRefGoogle Scholar
34Tzenov, N., Barsoum, M.W., and El-Raghy, T.: Influence of small amounts of Fe and V on the synthesis and stability of Ti3SiC2. J. Eur. Ceram. Soc. 20, 801 (2000).Google Scholar
35Esposito, L., Bellosi, A., and Celotti, G.: Silicon nitride-nickel joints through diffusion bonding. Acta Mater. 45, 5087 (1997).Google Scholar