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Microstructure and compression behavior of chip consolidated magnesium

Published online by Cambridge University Press:  12 January 2012

Adamane R. Anilchandra ,
Ritwik Basu ,
Indradev Samajdar  and
Mirle K. Surappa
Adamane R. Anilchandra*
Affiliation:
Department of Materials Engineering, Indian Institute of Science, Bengaluru 560012, India
Ritwik Basu
Affiliation:
Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology—Bombay, Mumbai 400076, India
Indradev Samajdar
Affiliation:
Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology—Bombay, Mumbai 400076, India
Mirle K. Surappa
Affiliation:
Department of Materials Engineering, Indian Institute of Science, Bengaluru 560012, India Director, Indian Institute of Technology—Ropar, Rupnagar 140001, Punjab, India (on Deputation from Department of Materials Engineering, Indian Institute of Science, Bengaluru 560012, India)
*
a)Address all correspondence to this author. e-mail: anilc@platinum.materials.iisc.ernet.in
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Abstract

Chips produced by turning a commercial purity magnesium billet were cold compacted and then hot extruded at four different temperatures: 250, 300, 350, and 400 °C. Cast billets, of identical composition, were also extruded as reference material. Chip boundaries, visible even after 49:1 extrusion at 400 °C, were observed to suppress grain coarsening. Although 250 °C extruded chip-consolidated product showed early onset of yielding and lower ductility, fully dense material (extruded at 400 °C) had nearly 40% reduction in grain size with 22% higher yield strength and comparable ductility as that of the reference. The study highlights the role of densification and grain refinement on the compression behavior of chip consolidated specimens.

Keywords

ExtrusionGrain sizeHardness
Type
Articles
Information
Journal of Materials Research , Volume 27 , Issue 4 , 28 February 2012 , pp. 709 - 719
Copyright
Copyright © Materials Research Society 2012

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References

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