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Microstructural Evolution of an Ultrafine-grained Cryomilled Al 5083 Alloy During Thermomechanical Processing

Published online by Cambridge University Press:  01 August 2005

David Witkin ,
Bing Q. Han  and
Enrique J. Lavernia
David Witkin*
Affiliation:
Department of Chemical Engineering and Materials Science, University of California, Irvine, Irvine, California 92697-2575
Bing Q. Han
Affiliation:
Department of Chemical Engineering and Materials Science, University of California, Davis, Davis, California 95616
Enrique J. Lavernia
Affiliation:
Department of Chemical Engineering and Materials Science, University of California, Davis, Davis, California 95616
*
a) Address all correspondence to this author. e-mail: dwitkin@uci.edu
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Abstract

The microstructural changes in cryomilled and consolidated Al 5083 following compression testing at several temperatures are described. Prior to testing, the material had an average grain size of approximately 138 nm and exhibited a duplex microstructure, containing coarse grains between 500 and 2000 nm. After uniaxial compressive deformation at temperatures between 423 and 573 K (0.49–0.66 Tm), the average grain size increased to between 200 and 300 nm, consistent with the average grain size of extrusions formed from the same material at similar temperatures. The similarity in grain size distribution following uniaxial compression or extrusion despite differences in total strain and stress state imposed by each indicates that much of the deformation in the extrusion process occurs in coarse-grained regions.

Keywords

CryomillingExtrusionGrain growth
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 8 , August 2005 , pp. 2117 - 2126
Copyright
Copyright © Materials Research Society 2005

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