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Liquid-exchange processing and properties of SiC–Al composites

Published online by Cambridge University Press:  31 January 2011

Leszek Hozer
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Yet-Ming Chiang
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139
Svetlana Ivanova
Affiliation:
Department of Materials Science and Engineering, Worcester Polytechnic Institute, Worcester, Massachusetts 01609
Isa Bar-On
Affiliation:
Department of Materials Science and Engineering, Worcester Polytechnic Institute, Worcester, Massachusetts 01609
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Abstract

In this paper we demonstrate a novel liquid-exchange process to replace a secondary silicon phase in reaction-bonded siliconized silicon carbides (RBSC's) with a ductile metal reinforcement phase. When RBSC is exchanged with pure Al or Al–Si liquid, secondary phase silicon is dissolved and is substituted by Al or Al–Si alloy. The resulting composites show improvements in fracture toughness (single-edge precracked beam technique), with KIC value up to 8.6 Mpa · m1/2, compared to 3–4 MPa · m1/2 in otherwise similar siliconized silicon carbide. Increased fracture strength (four point flexure) was also observed after the liquid exchange process. The processing furthermore allows the coefficient of thermal expansion to be adjusted, and the thermal conductivity increased, for electronic packaging applications.

Type
Articles
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

1.Zweben, C., JOM 44, 15 (1992).CrossRefGoogle Scholar
2.Thermal Expansion. Nonmetallic Solids, edited by Touloukian, Y. S., Kirby, R. K., Taylor, R. E., and Lee, T. Y. R. (Thermophysical Properties of Matter 3, IFI/Plenum, New York, 1977).CrossRefGoogle Scholar
3.Shen, Y-L., Needleman, A., and Suresh, S., Metall. Mat. Trans. A 25A, 839 (1994).CrossRefGoogle Scholar
4.Hozer, L. and Chiang, Y-M., J. Mater. Res. 11, 2346 (1996).CrossRefGoogle Scholar
5.Hozer, L., Lee, J-R., and Chiang, Y-M., in Advanced Synthesis and Processing of Composites and Advanced Ceramics, edited by Logan, K. V. (Ceramic Transactions 56, The American Ceramic Society, Westerville, OH, 1995), pp. 157165.Google Scholar
6.Hozer, L., Lee, J-R., and Chiang, Y-M., Mater. Sci. Eng. A 195, 131 (1995).CrossRefGoogle Scholar
7.Handwerker, C. A., Vaudin, M. D., Kattner, U. R., and Lee, D-J., in Metal-Ceramic Interfaces, edited by Rühle, M., Evans, A. G., Ashby, M. F., and Hirth, J. P. (Acta-Scripta Metall. Proc. Series 4, Pergamon Press, Oxford, 1989), pp. 129137, and private communication.Google Scholar
8.Nose, T. and Fuji, T., J. Am. Ceram. Soc. 71, 328 (1988).CrossRefGoogle Scholar
9.Bar-On, I., Beals, J., Leatherman, G., and Murray, C., J. Am. Ceram. Soc. 73, 2519 (1990).CrossRefGoogle Scholar
10. Orton Refractories Testing and Research Center, Westerville, OH.Google Scholar
11.Constant, K., Lee, J-R., and Chiang, Y-M., J. Mater. Res. 11, 2338 (1996).CrossRefGoogle Scholar
12.Nichtawitz, A., Thesis, M.S., Massachusetts Institute of Technology, June (1996).Google Scholar