Hostname: page-component-848d4c4894-4hhp2 Total loading time: 0 Render date: 2024-05-25T04:20:34.649Z Has data issue: false hasContentIssue false

Laser induced deposition of copper and lead powders

Published online by Cambridge University Press:  31 January 2011

Dontula Narasimharao
Affiliation:
Department of Chemical Engineering, Clarkson University, Potsdam, New York 13699-5705
Suryadevara V. Babu
Affiliation:
Department of Chemical Engineering, Clarkson University, Potsdam, New York 13699-5705
Don H. Rasmussen*
Affiliation:
Department of Chemical Engineering, Clarkson University, Potsdam, New York 13699-5705
*
a)Author to whom correspondence should be directed.
Get access

Abstract

Copper and lead powders were precipitated by laser-induced reduction of copper(II) formate, copper(II) acetate, and lead(II) acetate dispersed/dissolved in glycerine by exposure to 248 nm KrF pulsed laser radiation. The deposited powders consisted of pure copper and a mixture of pure lead and partially reduced metallo-organic complexes, respectively. The reduction of the metallo-organic complex of lead was completed thermally. Temperature, concentration, laser pulse repetition rate, and stirring influenced the deposition rate in both cases. The copper particles were predominantly hexagonal in shape and ranged in size from 0.01–0.04 μm. The lead particles were football shaped and had a very narrow size distribution, with an axial dimension of about 0.5 μm. It was shown from a spectroscopic analysis of the reaction products that the initial nucleation was caused by photochemical processes. However, exposure of the nonaqueous solutions to CO2 laser pulses at room temperature did not yield any particles.

Type
Articles
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Andres, R. P., Averback, R. S., Brown, W. L., Brus, L. E., Goddard, W. A. III, Kaldor, A., Louie, S. G., Moscovits, M., Peercy, P. S., Riley, S. J., Siegel, R. W., Spaepen, F., and Wang, Y., J. Mater. Res. 4, 704 (1989).CrossRefGoogle Scholar
2.Karlicek, R. F., Donnelly, V. M., and Collins, G. J., J. Appl. Phys. 53, 1084 (1982).CrossRefGoogle Scholar
3.Micheels, R. H., Darrow, A. D., and Rauh, R. D., Appl. Phys. Lett. 39, 418 (1981).CrossRefGoogle Scholar
4.Nanai, L., Hevesi, I., Bunkin, F. V., Luk'yanchuk, B. S., Brook, M. R., Shafeev, G. A., Jelski, D. A., Wu, Z. C., and George, F., Appl. Phys. Lett. 54, 736 (1989).CrossRefGoogle Scholar
5.Rose, T. L., Longendorger, D. H., and Rouf, R. D., Appl. Phys. Lett. 42, 193 (1983).CrossRefGoogle Scholar
6.Al-Sufi, A. K., Eichler, H. J., Salk, J., and Reidel, H. J., J. Appl. Phys. 54, 3629 (1983).CrossRefGoogle Scholar
7.Brook, M. R., Grandberg, K. I., and Shafeev, G. A., Appl. Phys. A 52, 78 (1991).CrossRefGoogle Scholar
8.Lu, Y. F., Takai, M., Nakata, T., Nagatomo, S., and Namba, S., Appl. Phys. A 52, 129 (1991).CrossRefGoogle Scholar
9.Zouari, I., Lapicque, F., Calvo, M., and Cabrera, M., Chem. Engg. Sci. 45, 2467 (1990).CrossRefGoogle Scholar
10.Gutfeld, R. J. von, Acosta, R., and Romankiw, L., IBM J. Res. Dev. 26, 136 (1982).CrossRefGoogle Scholar
11.Gutfeld, R. J. von, Gelchinski, M. H., Romankiw, L. T., and Vigliotti, D. R., Appl. Phys. Lett. 43 (9), 876 (1983).CrossRefGoogle Scholar
12.Tsao, J. and Ehrlich, D., J. Electrochem. Soc. 133, 2244 (1986).CrossRefGoogle Scholar
13.Ritz, M., M. S. Thesis, Clarkson University (1987).Google Scholar
14.Ritz, M., Babu, S. V., Srinivasan, V., and Patel, R. C., in Photon, Beam, and Plasma Stimulated Chemical Processes at Surfaces, edited by Donnelly, V. M., Herman, I. P., and Hirose, M. (Mater. Res. Soc. Symp. Proc. 75, Pittsburgh, PA, 1987), p. 433.Google Scholar