Hostname: page-component-848d4c4894-8kt4b Total loading time: 0 Render date: 2024-06-29T14:35:09.776Z Has data issue: false hasContentIssue false
  • English
  • Français

Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications

Published online by Cambridge University Press:  31 January 2011

Jack C. Hay ,
Eric G. Liniger  and
Xiao Hu Liu
Jack C. Hay*
Affiliation:
Fast Forward Devices, 11020 Solway School Road, Suite 113, Knoxville, Tennessee 37931
Eric G. Liniger
Affiliation:
I.B.M. Research, P.O. Box 218, Yorktown Heights, New York 10598–0218
Xiao Hu Liu
Affiliation:
I.B.M. Research, P.O. Box 218, Yorktown Heights, New York 10598–0218
*
a)Address all correspondence to this author. e-mail: jchay@ffdevices.com
Get access

Abstract

The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young's moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 2 , February 2001 , pp. 385 - 393
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Hutchinson, J.W. and Suo, Z., Adv. Appl. Mech. 29, 63 (1992).CrossRefGoogle Scholar
2.Evans, A.G., Ruhle, M., Dalgleish, B.J., and Charalambides, P.G., Metall. Trans. 21A, 2419 (1990).CrossRefGoogle Scholar
3.Ma, Q., Bumgarner, J., Fujimoto, H., Lane, M., and Dauskardt, R.H. in Materials Reliability in Microelectronics VII, edited by Clement, J.J., Keller, R.R., Krisch, K.S., Sanchez, J.E. Jr., and Zuo, Z. (Mater. Res. Soc. Symp. Proc. 473, Warrendale, PA, 1997), pp. 3–14.Google Scholar
4.Ahn, J., Mittal, K.L., and MacQueen, R.H., in ASTM STP 640, edited by Mittal, K.L., (American Society for Testing and Materials, Philadelphia, PA, 1978), p. 134.Google Scholar
5.Wu, T.W., J. Mater. Res. 6, 407 (1991).CrossRefGoogle Scholar
6.Venkataraman, S., Kohlstedt, D.L., and Gerberich, W.W., J. Mater. Res. 7, 1126 (1992).CrossRefGoogle Scholar
7.de Boer, M.P., Nelson, J.C., and Gerberich, W.W., in Thin Films: Stresses and Mechanical Properties VI, edited by Gerberich, W.W., Gao, H., Sundgren, J-E., and Baker, S.P. (Mater. Res. Soc. Symp. Proc. 436, Warrendale, PA, 1997), pp. 103–108.Google Scholar
8.Rossington, C., Evans, A.G., Marshall, D.B., and Khuri-Yakub, B.T., J. Appl. Phys. 56, 2639 (1984).CrossRefGoogle Scholar
9.Marshall, D.B. and Evans, A.G., J. Appl. Phys. 56, 2632 (1984).CrossRefGoogle Scholar
10.Rosenfeld, L.G., Ritter, J.E., Lardner, T.J., and Lin, M.R., J. Appl Phys. 67, 3291 (1990).CrossRefGoogle Scholar
11.Evans, A.G. and Hutchinson, J.W., Int. J. Solids Struct. 20, 455 (1984).CrossRefGoogle Scholar
12.Kriese, M.D., Moody, N.R., and Gerberich, W.W., Acta Mater. 46, 6623 (1998).CrossRefGoogle Scholar
13.Kim, K-S. and Aravas, N., Int. J. Solids Struct. 24, 417 (1988).CrossRefGoogle Scholar
14.Kim, K-S. and Kim, J., J. Eng. Mat. Technol. 110, 266 (1988).CrossRefGoogle Scholar
15.Malyshev, B. and Salganik, R.L., J. Fract. Mech. 1, 114 (1965).CrossRefGoogle Scholar
16.Bennett, S.J., Devries, K.L., and Williams, M.L., Int. J. Fract. 10, 33 (1974).CrossRefGoogle Scholar
17.Thouless, M.D. and Jensen, H.M., Adhesion, J.Sci. Technol., 8, 579 (1994).Google Scholar
18.Snodgrass, J.M., Hotchkiss, G., and Dauskardt, R.H., in Electronic Packaging Materials Science X, edited by Belton, D.J., Gaynes, M., Jacobs, E.G., Pearson, R., and Wu, T. (Mater. Res. Symp. Proc 515, Warrendale, PA, 1998), pp. 37–43.Google Scholar
19.Bagchi, A., Lucas, G.E., Suo, Z., and Evans, A.G., J. Mater. Res. 9, 1734 (1994).CrossRefGoogle Scholar
20.Drory, M.D., Thouless, M.D., and Evans, A.G., Acta Metall. 36, 2019 (1988).CrossRefGoogle Scholar
21.He, M.Y., Xu, G., and Clarke, D.R., in Materials Reliability in Microelectronics VII, edited by Clement, J.J., Keller, R.R., Krisch, K.S., Sanchez, J.E. Jr., and Zuo, Z. (Mater. Res. Soc. Symp. Proc. 473, Warrendale, PA, 1997), pp. 15–20.Google Scholar
22.Xu, G., Ragan, D.D., Clarke, D.R., He, M.Y., Ma, Q., and Fujimoto, H., in Interfacial Engineering for Optimized Properties, edited by Briant, C.L., Carter, C.B., and Hall, E.L. (Mater. Res. Soc. Symp. Proc. 458, Warrendale, PA, (1997), pp. 465–470.Google Scholar
23.Shaffer, E.O., Mills, M.E., Hawn, D., Van Gestel, M., Knorr, A., Gundlach, H., Kumar, K., Kaloyeros, A.E., and Geer, R.E., in Low-Dielectric Constant Materials IV, edited by Chiang, C., Ho, P.S., Lu, T-M., and Wetzel, J.T. (Mater. Res. Soc. Symp. Proc. 511, Warrendale, PA, 1998), pp. 133–138.Google Scholar
24.Shaffer, E.O., Sikorski, S.A., and McGarry, F.J., in Materials Reliability in Microelectronis IV, edited by Børgesen, P., Coburn, J.C., Sinchez, J.E. Jr., Rodbell, K.P., and Filter, W.F. (Mater. Res. Soc. Symp. Proc. 338, Pittsburgh, PA, 1994), p. 541–551.Google Scholar
25.McGarry, F.J. and Shaffer, E.O., in Thin Films: Stresses and Mechanical Properties V, edited by Baker, S.P., Børgesen, P., Townsend, P.H., Ross, C.A., and Volkert, C.A. (Mater. Res. Soc. Symp. Proc. 356, Pittsburgh, PA, 1995), p. 515.Google Scholar
26.Shaffer, E.O., McGarry, E.J., and Hoang, L., Polymer Eng. Sci. 36, 2375 (1996).CrossRefGoogle Scholar
27.Shaffer, E.O., McGarry, F.J., and Trusell, F., in Thin Films: Stress and Mechanical Properties IV, edited by Townsend, P.H., Weihs, T.P., Sanchez, J.E. Jr., and Børgesen, P. (Mater. Res. Soc. Symp. Proc. 308, Pittsburgh, PA, 1993), p. 535–539.Google Scholar
29.Hay, J.C., Liniger, E.G., and Liu, X-H., in Adhesion Measurements of Films and Coatings, edited by Mittal, K.L. (VSP, Utrecht, 2000), Vol. 2, pp. 205–217.Google Scholar