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Effect of sintering additive composition on the thermal conductivity of silicon nitride

Published online by Cambridge University Press:  31 January 2011

Y. Okamoto ,
N. Hirosaki ,
M. Ando ,
F. Munakata  and
Y Akimune
Y. Okamoto
Affiliation:
Materials Research Laboratory, Nissan Motor Co., Ltd., 1, Natsushima-cho, Yokosuka-shi,Kanagawa 237–8523, Japan
N. Hirosaki
Affiliation:
Materials Research Laboratory, Nissan Motor Co., Ltd., 1, Natsushima-cho, Yokosuka-shi,Kanagawa 237–8523, Japan
M. Ando
Affiliation:
Materials Research Laboratory, Nissan Motor Co., Ltd., 1, Natsushima-cho, Yokosuka-shi,Kanagawa 237–8523, Japan
F. Munakata
Affiliation:
Materials Research Laboratory, Nissan Motor Co., Ltd., 1, Natsushima-cho, Yokosuka-shi,Kanagawa 237–8523, Japan
Y Akimune
Affiliation:
Materials Research Laboratory, Nissan Motor Co., Ltd., 1, Natsushima-cho, Yokosuka-shi,Kanagawa 237–8523, Japan
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Abstract

The thermal conductivity of silicon nitride prepared with varying sintering additive compositions was studied. Samples of Si3N4 + 0.5 mol% Y2O3 + 0.5 mol% Nd2O3 and a further additional agent were gas pressure sintered at 2173 K. MgO or Al2O3 was employed as the additional agent. While both agents improved sinterability, the former promoted grain growth and the latter suppressed it. Thermal conductivity increased with increasing MgO content, and a maximum value of 128 Wm-1 K-1 was attained when 2 mol% MgO was added. In contrast, addition of Al2O3 degrades thermal conductivity. This is probably due to the suppression of grain growth and the dissolution of Al2O3 into Si3N4 grains.

Type
Articles
Information
Journal of Materials Research , Volume 13 , Issue 12 , December 1998 , pp. 3473 - 3477
Copyright
Copyright © Materials Research Society 1998

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