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Ductile-to-brittle transition induced by increasing strain rate in Sn–3Cu/Cu joints

Published online by Cambridge University Press:  31 January 2011

H.F. Zou  and
Z.F. Zhang
H.F. Zou
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Science, Shenyang 110016, People’s Republic of China
Z.F. Zhang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Science, Shenyang 110016, People’s Republic of China
*
a)Address all correspondence to this author. e-mail: zhfzhang@imr.ac.cn
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Abstract

The current study revealed the effects of strain rate on tensile strength and ductile-to-brittle transition of Sn–3Cu/Cu joints in the strain rate range of 4.2 × 10−5 to 2.4 × 10−1 s−1. Experimental results indicate that these joints broke in a ductile manner at low strain rates with a rapid increase in the tensile strength but displayed a brittle manner at higher strain rates with a slow increase in the tensile strength, indicating a typical ductile-to-brittle transition feature. A method was proposed to estimate the interfacial strength between the solder and the intermetallic compounds.

Keywords

AdhesionFractureSoldering
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 6 , June 2008 , pp. 1614 - 1617
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

1Abtew, M.Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng., R 27, 95 2000CrossRefGoogle Scholar
2Zeng, K.Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng., R 38, 55 2002CrossRefGoogle Scholar
3Yang, S.C., Ho, C.E., Chang, C.W.Kao, C.R.: Massive spalling of intermetallic compounds in solder–substrate reactions due to limited supply of the active element. J. Appl. Phys. 101, 084911 2007CrossRefGoogle Scholar
4Zhu, F., Zhang, H., Guan, R.Liu, S.: The effect of temperature and strain rate on the tensile properties of a Sn99.3Cu0.7(Ni) lead-free solder alloy. Microelectron. Eng. 84, 144 2007CrossRefGoogle Scholar
5Lang, F., Tanaka, H., Munegata, O., Taguchi, T.Narita, T.: The effect of strain rate and temperature on the tensile properties of Sn–3.5Ag solder. Mater. Charact. 54, 223 2005CrossRefGoogle Scholar
6Shohji, I., Yoshida, T., Takahashi, T.Hioki, S.: Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity. Mater. Sci. Eng., A 366, 50 2004CrossRefGoogle Scholar
7Wu, B.Y., Zhong, H.W., Chan, Y.C.Alam, M.O.: Shearing tests of solder joints on tape ball grid array substrates. J. Mater. Res. 21(9), 2224 2006CrossRefGoogle Scholar
8Ren, F., Nah, J.W., Tu, K.N., Xiong, B., Xu, L.Pang, J.H.L.: Electromigration induced ductile-to-brittle transition in lead-free solder joints. Appl. Phys. Lett. 89, 141914 2006CrossRefGoogle Scholar
9Lee, H.T.Chen, M.H.: Influence of intermetallic compounds on the adhesive strength of solder joints. Mater. Sci. Eng., A 333, 24 2002CrossRefGoogle Scholar
10Lee, H.T., Chen, M.H., Jao, H.M.Liao, T.L.: Influence of interfacial intermetallic compound on fracture behavior of solder joints. Mater. Sci. Eng., A 358, 134 2003CrossRefGoogle Scholar
11Yoon, J.W., Kim, S.W.Jung, S.B.: Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging. J. Alloys Compd. 391, 82 2005CrossRefGoogle Scholar
12Bae, K.S.Kim, S.J.: Microstructure and adhesion properties of Sn–0.7Cu/Cu solder joints. J. Mater. Res. 17(4), 743 2002CrossRefGoogle Scholar
13Pang, L., Han, S.M.Kumar, K.S.: Tensile response of an Fe–40Al–0.7C–0.5B alloy. Acta Mater. 50, 3623 2002CrossRefGoogle Scholar
14Pang, L.Kumar, K.S.: Mechanical behavior of an Fe–40Al–0.6C alloy. Acta Mater. 46(11), 4017 1998CrossRefGoogle Scholar
15Kim, D.G., Kim, J.W.Jung, S.B.: Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn–3.0Ag–0.5Cu solder and Ni–P UBM. Mater. Sci. Eng., B 121, 204 2005CrossRefGoogle Scholar
16Date, M., Shoji, T., Fujiyoshi, M., Sato, K.Tu, K.N.: Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test. Scripta Mater. 51, 641 2004CrossRefGoogle Scholar
17Zeng, K., Stierman, R., Chiu, T.C., Edwards, D., Ano, K.Tu, K.N.: Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability. J. Appl. Phys. 97, 024508 2005CrossRefGoogle Scholar
18Deng, X., Chawla, N., Chawla, K.K.Koopman, M.: Deformation behavior of (Cu,Ag)–Sn intermetallics by nanoindentation. Acta Mater. 52, 4291 2004CrossRefGoogle Scholar