Hostname: page-component-76fb5796d-qxdb6 Total loading time: 0 Render date: 2024-04-27T00:29:05.140Z Has data issue: false hasContentIssue false
  • English
  • Français

Deformation mechanisms of Al films on oxidized Si wafers

Published online by Cambridge University Press:  03 March 2011

C.A. Volkert ,
C.F. Alofs  and
J.R. Liefting
C.A. Volkert
Affiliation:
AT&T Bell Laboratories, 600 Mountain Avenue, Murray Hill, New Jersey 07974
C.F. Alofs
Affiliation:
FOM Institute AMOLF, Amsterdam, The Netherlands
J.R. Liefting
Affiliation:
FOM Institute AMOLF, Amsterdam, The Netherlands
Get access

Abstract

The mechanism for plastic deformation of 0.5 μm thick, 0.5 μm grain-size evaporated Al films on oxidized Si wafers has been studied using wafer curvature measurements over a temperature range from room temperature to 500 °C. Extensive evidence for both morphology changes and plastic deformation was obtained. Transmission electron microscopy confirmed the occurrence of grain growth, and stress changes attributed to recrystallization were observed. Deformation under tension could be explained by dislocation glide according to the kinetics observed in bulk Al at the same temperatures, stresses, and grain sizes. The kinetics of deformation under compression were investigated at 400 °C and were completely different from those under tension. This is either due to a difference in the deformation mechanism or to the occurrence of work softening.

Type
Articles
Information
Journal of Materials Research , Volume 9 , Issue 5 , May 1994 , pp. 1147 - 1155
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Mader, S. and Chaudhari, P., J. Vac. Sci. Technol. 6, 615 (1969).CrossRefGoogle Scholar
2Sinha, A. K. and Sheng, T. T., Thin Solid Films 48, 117 (1978).CrossRefGoogle Scholar
3Koleshko, V. M., Belitsky, V. F., and Kiryushin, I. V., Thin Solid Films 142, 199 (1986).CrossRefGoogle Scholar
4Flynn, P. A., Gardner, D. S., and Nix, W. D., IEEE Trans. Electron. Dev. ED–34, 689 (1987).CrossRefGoogle Scholar
5Gardner, D. S. and Flynn, P. A., J. Appl. Phys. 67 (4), 1831 (1990).CrossRefGoogle Scholar
6Brotzen, F. R., Rosemayer, C. T., and Gale, R. J., Thin Solid Films 166, 291 (1988).CrossRefGoogle Scholar
7Venkatraman, R., Bravman, J. C., Nix, W. D., Davies, P. W., Flynn, P. A., and Fraser, D. B., J. Electron. Mater. 19 (11), 1231 (1990).CrossRefGoogle Scholar
8Venkatraman, R. and Bravman, J. C., J. Mater. Res. 7, 2040 (1992).Google Scholar
9Chaudhari, P., IBM J. Res. Develop. 13, 197 (1969).CrossRefGoogle Scholar
10The deformation mechanisms of bulk Al have been studied extensively and are reviewed in many papers and books. A good reference is Deformation-Mechanism Maps, by Frost, H. J. and Ashby, M. F. (Pergamon Press, Oxford, 1982).Google Scholar
11Hansen, N., Acta Metall. 25, 863 (1977).CrossRefGoogle Scholar
12Ashby, M. F., Philos. Mag. 21, 399 (1970).CrossRefGoogle Scholar
13Armstrong, R. W., J. Mech. Phys. Solids 9, 196 (1961).CrossRefGoogle Scholar
14Doerner, M. F., Gardner, D. S., and Nix, W. D., J. Mater. Res. 1, 845 (1986); Doerner, M. F. and Nix, W. D., in CRC Critical Reviews in Solid State and Materials Sciences (CRC Press, Cleveland, OH, 1988), pp. 14, 225.CrossRefGoogle Scholar
15Chaudhari, P., J. Appl. Phys. 45, 4339 (1974).Google Scholar
16Hu, S. M., Appl. Phys. Lett. 59 (21), 2685 (1991).Google Scholar
17Korhonen, M. A., Paszkiet, C. A., and Li, C-Y., J. Appl. Phys. 69 (2), 8083 (1991).CrossRefGoogle Scholar
18Volkert, C. A., J. Appl. Phys. 70, 3527 (1991).Google Scholar
19Stoney, G. G., Proc. Roy. Soc. A82, 172 (1909).Google Scholar
20Brantley, W. A., J. Appl. Phys. 44, 543 (1973).CrossRefGoogle Scholar
21The morphology changes during deformation of bulk Al have been studied extensively and are discussed in many papers and books. Three such books are Fundamentals of Physical Metallurgy, by Verhoeven, J. D. (John Wiley & Sons, New York); Physical Metallurgy, by Cahn, R. W. and Haasen, P. (North-Holland Physics Publishing, Amsterdam); and The Theory of Transformations in Metals and Alloys, by Christian, J. W. (Pergamon Press, Oxford, 1965).Google Scholar
22Griffin, A. J. Jr., Brotzen, F. R., and Dunn, C. F., Scripta Metall. 20, 1271 (1986).CrossRefGoogle Scholar
23Nix, W. D., Metall. Trans. 20A, 2217 (1989).CrossRefGoogle Scholar
24Murakami, M., Thin Solid Films 59, 105 (1979).CrossRefGoogle Scholar
25Chaudhari, P., Philos. Mag. 39, 507 (1979).Google Scholar
26Argon, A. S., Scripta Metall. 4, 1001 (1970).CrossRefGoogle Scholar
27Mishra, R. S., Jones, H., and Greewodd, G. W., Philos. Mag. 60 (6), 581 (1989).CrossRefGoogle Scholar
28Eshelby, J. D., Proc Roy. Soc. A 241, 374 (1957); also Proc. Roy. Soc. A 251, 561 (1959).Google Scholar