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Comments on “A new procedure for measuring the decohesion energy for thin ductile films on substrates,” by A. Bagchi, G. E. Lucas, Z. Suo, and A. G. Evans [J. Mater. Res. 9, 1734 (1994)]

Published online by Cambridge University Press:  31 January 2011

O. Jørgensen
Affiliation:
Risø National Laboratory, Materials Department, DK-4000, Denmark
A. Horsewell
Affiliation:
Risø National Laboratory, Materials Department, DK-4000, Denmark
B. F. Sørensen
Affiliation:
Risø National Laboratory, Materials Department, DK-4000, Denmark
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Abstract

A recently proposed method for measuring decohesion energy of ductile films on substrates is discussed. The loading mechanism that causes the decohesion of the ductile film is that of gradually depositing an additional layer, with large residual tensile stresses, on top of the film. Hence, the method involves the decohesion of a bilayer film on a substrate. The suggested method assumes that the unloading of the film is controlled entirely by elasticity. This assumption is a prerequisite for the suggested linear elastic analysis, from which the interfacial debond energy is derived in closed form. However, as is shown in the present comment, large scale yielding can occur in the wake of the crack tip and is prohibitive to the suggested linear elastic analysis. A sufficient condition for the occurrence of said large scale yielding is outlined in the present comment. Indeed it is shown that large scale plasticity must have occurred in the experiments described by Bagchi et al.1

Type
Articles
Copyright
Copyright © Materials Research Society 1996

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References

REFERENCE

1.Bagchi, A., Lucas, G. E., Suo, Z., and Evans, A. G., J. Mater. Res. 9, 1734 (1994).CrossRefGoogle Scholar