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An analysis for geometrical effects on the cooling performance of (Bi, Sb)2Te3/Bi2(Te, Se)3-based thin film thermoelectric modules

Published online by Cambridge University Press:  31 January 2011

Il-Ho Kim  and
Dong-Hi Lee
Il-Ho Kim
Affiliation:
Department of Metallurgical Engineering, Yonsei University, 134 Shinchon-dong, Seodaemun-gu, Seoul, 120-749, Korea
Dong-Hi Lee
Affiliation:
Department of Metallurgical Engineering, Yonsei University, 134 Shinchon-dong, Seodaemun-gu, Seoul, 120-749, Korea
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Abstract

Geometrical effects on the cooling performance of the thin film thermoelectric (TFTE) modules were investigated by varying the film thickness and the number of p/n couples of the (Bi, Sb)2Te3/Bi2(Te, Se)3-based system which were fabricated by the flash evaporation technique. Maximum temperature difference (δTmax, maximum cooling) and optimum input current (Iopt) increased with film thickness for a fixed number of couples. For the case of given thickness, however, Iopt decreased with the number of couples, maintaining almost constant δTmax. The measured values for the cooling characteristics were compared with the results obtained through computer simulation work by the finite difference method (FDM). The thinner the film and the larger the number of p/n couples of the modules, the larger was the deviation between the experimental and the simulated values.

Type
Articles
Information
Journal of Materials Research , Volume 12 , Issue 2 , February 1997 , pp. 423 - 429
Copyright
Copyright © Materials Research Society 1997

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References

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