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Thermal stability of highly nanotwinned copper: The role of grain boundaries and texture

Published online by Cambridge University Press:  27 November 2012

Yifu Zhao ,
Timothy Allen Furnish ,
Michael Ernest Kassner  and
Andrea Maria Hodge
Yifu Zhao
Affiliation:
Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, California 90089
Timothy Allen Furnish
Affiliation:
Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, California 90089
Michael Ernest Kassner
Affiliation:
Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, California 90089
Andrea Maria Hodge*
Affiliation:
Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, California 90089
*
a)Address all correspondence to this author. e-mail: ahodge@usc.edu
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Abstract

To study the effect of nanotwins on thermal stability, a comprehensive characterization study was performed on two types of ultrafine grained (UFG) copper samples, with and without nanotwins. The two samples were sequentially heat-treated at elevated temperatures, and the grain size, grain boundary character, and texture were characterized after each heat treatment. The as-prepared nanotwinned (nt) copper foil had an average columnar grain size of ∼700 nm with a high density of coherent twin boundaries (CTBs) (twin thickness, ∼40 nm), which remained stable up to 300 °C. In contrast, the other UFG sample had few CTBs, and rapid grain growth was observed at 200 °C. The thermal stability of nt copper is discussed with respect to the presence of the low energy nanotwins, triple junctions between the twins and columnar grains, texture and grain growth.

Keywords

nanostructureannealinggrain boundaries
Type
Articles
Information
Journal of Materials Research , Volume 27 , Issue 24 , 28 December 2012 , pp. 3049 - 3057
Copyright
Copyright © Materials Research Society 2012

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