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Ruthenium clusters in lead-borosilicate glass in thick film resistors

Published online by Cambridge University Press:  03 March 2011

Kenji Adachi
Affiliation:
Sumitomo Metal Mining Company, Central Research Laboratory, Ichikawa 272, Japan
Sadahiro lida
Affiliation:
Sumitomo Metal Mining Company, Central Research Laboratory, Ichikawa 272, Japan
Kazuhide Hayashi
Affiliation:
Sumitomo Metal Mining Company, Central Research Laboratory, Ichikawa 272, Japan
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Abstract

An interparticle glass matrix in ruthenium dioxide-based thick film resistors has been studied intensively by means of analytical and high resolution transmission electron microscopy. The ruthenium dioxide phase interacts with lead-borosilicate glass at high temperature by dissolving ruthenium ions and incorporating a small number of lead and aluminum ions on the surface. Ruthenium ions diffuse through the glass network at least over a distance of 1 μm during firing, but are accommodated in the glass structure by an amount only less than 7 at. % at room temperature. High resolution electron microscopy reveals numerous ruthenium-pyrochlore crystallites in high-lead glasses, but hardly any Ru-based clusters/crystallites in low-lead glasses, where lead-rich glass clusters due to glass immiscibility and reduced lead metal clusters are more commonly observed instead of ruthenium clusters. Lead oxide is prone to reduction both in high- and low-lead glasses upon irradiating with a high-energy incident electron beam. Comparison with gold-based resistor and estimation of average dispersion length of ruthenium clusters, 2 to 4 nm, prefer the model of electron hopping via ruthenium clusters/crystallites as a dominant conduction mechanism in thick film resistors.

Type
Articles
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

1Nordstrom, T. V. and Hills, C. R., J. Hybrid Microelectronics 40, 14 (1980).Google Scholar
2Brady, L. J., Proc. IEEE Electronic Components Conf., Washington, DC (1967), p. 238.Google Scholar
3Prudenziati, M., Electrocomp. Sci. Tech. 10, 285 (1983).CrossRefGoogle Scholar
4Pike, G. E. and Seager, C. H., J. Appl. Phys. 48, 5152 (1977).CrossRefGoogle Scholar
5Forlani, F. and Prudenziati, M., Electrocomp. Sci. Tech. 3, 77 (1976).Google Scholar
6Hill, R. M., Proc. 2nd Europ. Hybrid Microelec. Conf., ISHM (1979), p. 95.Google Scholar
7Mott, N. F. and Davis, E. A., Electronic Processes in Non-Crystalline Materials, 2nd ed. (Oxford University Press, Oxford, 1979).Google Scholar
8Vest, R. W., Citale, S. M., and Kollipara, A. K., Proc. 5th Europ.Hybrid Microelec. Conf, Stresa, Italy (1985), p. 406.Google Scholar
9Adachi, K., lida, S., Ishigame, J., and Sekihara, S., J. Mater. Res. 6, 1729 (1991).Google Scholar
10Prabhu, A., Fuller, G. L., and Vest, R. W., J. Am. Ceram. Soc. 57, 408 (1974).Google Scholar
11Goldstein, J. I., Introduction to Analytical Electron Microscopy, edited by Goldstein, J. I. and Joy, D. C. (Plenum Press, New York, 1979), p. 83.CrossRefGoogle Scholar
12Adachi, K. and Inage, H., unpublished research.Google Scholar
13Johnson, D. W. and Hummel, F. A., J. Am. Ceram. Soc. 51, 196 (1968).Google Scholar
14Sacchi, M., Antonini, M., and Prudenziati, M., Phys. Status Solidi A 109, K23 (1988).CrossRefGoogle Scholar
15Sirotti, F., Sacchi, M., Prudenziati, M., and Antonini, M., Proc. 2nd Europ. Conf. on Prog, in X-ray Synchrotron Rad. Res., SIF, Bologna, Italy (1990), p. 547.Google Scholar