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Plasma activated sintering of additive-free AlN powders to near-theoretical density in 5 minutes

Published online by Cambridge University Press:  31 January 2011

Joanna R. Groza
Affiliation:
Division of Materials Science and Engineering, Department of Mechanical, Aeronautical, and Materials Engineering, University of California at Davis, Davis, California 95616-5294
Subhash H. Risbud
Affiliation:
Division of Materials Science and Engineering, Department of Mechanical, Aeronautical, and Materials Engineering, University of California at Davis, Davis, California 95616-5294
Kazuo Yamazaki
Affiliation:
Division of Materials Science and Engineering, Department of Mechanical, Aeronautical, and Materials Engineering, University of California at Davis, Davis, California 95616-5294
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Abstract

AlN powders (particle size = 0.44 ± 0.08 μm) containing no deliberate sintering additives were consolidated to near theoretical density in 5 min at 2003 K (1730 °C) using a Plasma Activated Sintering (PAS) process. PAS is a novel consolidation method that combines a very short time at high temperature with pressure application in a plasma environment. The in situ cleaning ability of powder particle during plasma activated densification leads to enhanced particle sinterability. The densities of undoped AlN specimens that were PAS consolidated at 2003 K for 5 min under 50 MPa pressure ranged from 97.5 to 99.3% of theoretical. The initial submicron particle size of AlN powders was retained in the final microstructure that consisted of polycrystalline grains with an average size of ≍0.77 ± 0.1 μm.

Type
Rapid Communications
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

1Bennett, C.E.G., McKinnon, N.A., and Williams, L. S., Nature 217, 1287 (1968).CrossRefGoogle Scholar
2Johnson, D. L., in Advanced Ceramics II, edited by Somiya, S. (Elsevier, London, 1986), pp. 16.Google Scholar
3Johnson, D.L. and Rizzo, R.A., Am. Ceram. Soc. Bull. 59, 467 (1980).Google Scholar
4Kim, J.S. and Johnson, D.L., Am. Ceram. Soc. Bull. 62, 620 (1983).Google Scholar
5Johnson, D.L., Kramb, V. A., and Lynch, D. C., in Emergent Process Methods for High-Technology Ceramics, Materials Science Research, edited by Davis, R. F., III, H. Palmour, and Porter, R. L. (Plenum Press, New York, 1984), Vol. 17, pp. 207211.CrossRefGoogle Scholar
6Kemer, E.L. and Johnson, D.L., Am. Ceram. Soc. Bull. 64, 1132 (1985).Google Scholar
7Johnson, D. L., Sanderson, W. B., Knowlton, J. M., Kemer, E. L., and Chen, M. Y., in High Tech Ceramics, edited by Vincenzini, P. (Elsevier Science Publishers, Amsterdam, 1987), pp. 815820.Google Scholar
8Upadhya, K., Am. Ceram. Soc. Bull. 67, 1691 (1988).Google Scholar
9Kijima, K., “Plasma Sintering of Ceramic Materials,” 7th Int. Symp. on Plasma Chemistry Proa, edited by Timmerans, C. J., 2, 662 667 (1985).Google Scholar
10Pan, W.X., Sato, M., Yoshida, T., and Akashi, K., Adv. Ceram. Mater. 3, 77 (1988).Google Scholar
11Wada, M. and Yamashita, F., “New Method of Making Nd-Fe-Co-B Full Dense Magnet”, presented at Intermag Conference, Brighton, U.K., April 17-20, 1990.CrossRefGoogle Scholar
12Kuramoto, N., Taniguchi, H., and Aso, L., Ceram. Bull. 68, 883 (1989).Google Scholar
13Sheppard, L.M., Ceram. Bull. 69, 1801 (1990).Google Scholar
14Horvath, S. F., Witek, S. R., and Harmer, M. P., Adv. Ceram. 26, 121 (1989).Google Scholar
15Teusel, I. and Russel, C., J. Mater. Sci. Lett. 22, 205 (1992).Google Scholar
16Knittel, S. M. and Risbud, S. H., in Combustion and Plasma Synthesis ofHigh Temperature Materials, edited by Munir, Z. A. and Holt, J.B. (VCH Publishers, New York, 1990), pp. 414419.Google Scholar
17Yamazaki, K., University of California, private communication.Google Scholar
18Averbach, R. S., Höfler, H.J., Hahn, H., and Logas, J. C.Nanostructured Materials 1, 173 (1992).Google Scholar