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In situ study of thermally activated flow and dynamic restoration of ultrafine-grained pure Cu at 373 K

Published online by Cambridge University Press:  18 September 2017

Wolfgang Blum*
Affiliation:
Institut für Werkstoffwissenschaften, University of Erlangen-Nürnberg, Erlangen D-91058, Germany
Petr Král
Affiliation:
Institute of Physics of Materials, Academy of Sciences of the Czech Republic, Brno CZ-61662, Czech Republic
Jiri Dvořák
Affiliation:
Institute of Physics of Materials, Academy of Sciences of the Czech Republic, Brno CZ-61662, Czech Republic
Martin Petrenec
Affiliation:
Tescan Orsay Holding a.s., Brno CZ-62300, Czech Republic
Philip Eisenlohr
Affiliation:
Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824, USA
Vaclav Sklenička
Affiliation:
Institute of Physics of Materials, Academy of Sciences of the Czech Republic, Brno CZ-61662, Czech Republic
*
a)Address all correspondence to this author. e-mail: wolfgang.blum@fau.de
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Abstract

Pure Cu was made ultrafine-grained by equal channel angular pressing on route BC at ambient temperatures and deformed in situ in a scanning electron microscope at the elevated temperature of 373 K and at a constant total strain rate of 10−4 s−1. Deformation was repetitively stopped to take micrographs of the grain structure on the same area of observation, revealing limited activity of discontinuous dynamic recrystallization. During the stops of deformation, the flow stress was relaxing. The relaxation of stress as function of time was used to determine the rate of inelastic deformation as a function of stress, from which the activation volume ${V^ * }$ of the thermally activated flow was derived. It is found that the normalized values of ${V^ * }$ were lying in the same order generally found for coarse-grained pure materials. This seems to be in conflict with the literature. However, the conflict is resolved by noting that the literature results refer to quasistationary deformation with the concurrent dynamic recovery in contrast to the present results obtained at a virtually constant microstructure. The interpretation of the two kinds of activation volumes for thermally activated flow is discussed.

Type
Articles
Copyright
Copyright © Materials Research Society 2017 

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Footnotes

Contributing Editor: Mathias Göken

Dedicated to Prof. Hael Mughrabi on the occasion of his 80th birthday.

References

REFERENCES

Valiev, R.Z., Islamgaliev, R.K., and Alexandrov, I.V.: Bulk nanostructured materials from severe plastic deformation. Prog. Mater. Sci. 45, 103 (2000).CrossRefGoogle Scholar
Höppel, H.W., Brunnbauer, M., Mughrabi, H., Valiev, R.Z., and Zhilyaev, A.P.: Cyclic deformation behaviour of ultrafine grain size copper produced by equal channel angular extrusion. In Materials Week 2000-Proceedings (Werkstoffwoche-Partnerschaft GbR, Frankfurt, 2001); p. 1.Google Scholar
Höppel, H.W., Zhou, Z.M., Mughrabi, H., and Valiev, R.Z.: Microstructural study of the parameters governing coarsening and cyclic softening in fa-tigued ultrafine-grained copper. Philos. Mag. A 9, 1781 (2002).CrossRefGoogle Scholar
Molodova, X., Gottstein, G., Winning, M., and Hellmig, R.J.: Thermal stability of ECAP processed pure copper. Mater. Sci. Eng., A 460–461, 204 (2007).Google Scholar
Blum, W., Li, Y.J., and Durst, K.: Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures. Acta Mater. 57, 5207 (2009).CrossRefGoogle Scholar
Ivanov, K.V. and Naydenkin, E.V.: Activation parameters and deformation mechanisms of ultrafine-grained copper under tension at moderate temperatures. Mater. Sci. Eng., A 608, 123 (2014).Google Scholar
Blum, W., Dvorak, J., Kral, P., Petrenec, M., Eisenlohr, P., and Sklenicka, V.: In situ study of structure and strength of severely predeformed pure Cu in deformation at 573 K. Philos. Mag. 95(33), 3696 (2015).Google Scholar
Frost, H.J. and Ashby, M.F.: Deformation-Mechanism Maps (Pergamon Press, Oxford, 1982); p. 166.Google Scholar
Petrenec, M., Kral, P., Dvorak, J., Svoboda, M., and Sklenicka, V.: In situ testing and heterogeneity of UFG Cu at elevated temperatures. J. Achiev. Mater. Manuf. Eng. 62(2), 69 (2014).Google Scholar
Blum, W., Li, Y.J., Zhang, Y., and Wang, J.T.: Deformation resistance in the transition from coarse-grained to ultrafine-grained Cu by severe plastic deformation up to 24 passes of ECAP. Mater. Sci. Eng., A 528, 8621 (2011).Google Scholar
Blum, W.: High-temperature deformation and creep of crystalline solids. In Plastic Deformation and Fracture of Materials, Mughrabi, H., ed.; Materials Science and Technology, Vol. 6 of series Materials Science and Technology, Cahn, R.W., Haasen, P., and Kramer, E.J., eds. (VCH Verlagsgesellschaft, Weinheim, 1993); p. 359.Google Scholar
Li, Y.J., Mueller, J., Höppel, H.W., Göken, M., and Blum, W.: Deformation kinetics of nanocrystalline nickel. Acta Mater. 55, 5708 (2007).Google Scholar
Li, Y.J., Zeng, X.H., and Blum, W.: Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu. Acta Mater. 52(17), 5009 (2004).CrossRefGoogle Scholar
Nes, E.: Modelling work hardening and stress saturation in FCC metals. Prog. Mater. Sci. 41(3), 129 (1998).CrossRefGoogle Scholar
Mecking, H., Nicklas, B., Zarubova, N., and Kocks, U.F.: An “universal” temperature scale for plastic flow. Acta Metall. 34, 527 (1986).Google Scholar
Kocks, U.F.: Proceedings of the Conference at the 50th Anniversary Meeting on Dislocations and Properties of Real Materials (The Institute of Metals, London, 1985); p. 125.Google Scholar
Kocks, U.F. and Mecking, H.: Physics and phenomenology of strain hardening: The FCC case. Prog. Mater. Sci. 48(3), 171 (2003).CrossRefGoogle Scholar
Mukherjee, A.K., Bird, J.E., and Dorn, J.E.: Experimental correlations for high-temperature creep, ASM Trans. Q. 62(155) (1969).Google Scholar
Cadek, J.: Creep in Metallic Materials (Elsevier, Amsterdam, 1988); p. 270.Google Scholar
Kassner, M. and Perez-Prado, M.T.: Fundamentals of Creep in Metals and Alloys (Elsevier, Amsterdam, 2004); p. 338.Google Scholar
Caillard, D.: A model of creep at intermediate temperatures in aluminium. Philos. Mag. A 51(1), 157 (1985).CrossRefGoogle Scholar
Caillard, D. and Martin, J.L.: New trends in creep microstructural models for pure metals. Rev. Phys. Appl. 22, 169 (1987).Google Scholar
Blum, W., Rosen, A., Cegielska, A., and Martin, J.L.: Two mechanisms of dislocation motion during creep. Acta Metall. 37, 2439 (1989).CrossRefGoogle Scholar
Sun, Z., Van Petegem, S., Cervellino, A., Durst, K., Blum, W., and Van Swygenhoven, H.: Dynamic recovery in nanocrystalline Ni. Acta Mater. 91, 91 (2015).Google Scholar
Armstrong, R.W.: Thermal activation strain rate analysis (TASRA) for polycrystalline materials, (Indian) J. Sci. Indust. Res. 32, 591 (1973).Google Scholar
Armstrong, R.W. and Balasubramanian, N.: Physically-based and power-law constitutive relations for higher temperature metal processing and creep-type deformations. J. Met. 69(5), 822 (2017).Google Scholar
Duhamel, C., Brechet, Y., and Champion, Y.: Activation volume and deviation from Cottrell–Stokes law at small grain size. Int. J. Plast. 26, 747 (2010).Google Scholar
Armstrong, R.W.: Comparison of grain size and strain rate influences on higher temperature metal strength and fracturing properties. In David M.R. Taplin Symposium, Proc. 14th International Conference on Fracture (ICF14) (Rhodes, Greece, 2017).Google Scholar