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The growth of silicon nitride crystalline films using microwave plasma enhanced chemical vapor deposition

Published online by Cambridge University Press:  03 March 2011

K.J. Grannen ,
F. Xiong  and
R.P.H. Chang
K.J. Grannen
Affiliation:
Northwestern University, Department of Materials Science and Engineering, Evanston, Illinois 60208
F. Xiong
Affiliation:
Northwestern University, Department of Materials Science and Engineering, Evanston, Illinois 60208
R.P.H. Chang
Affiliation:
Northwestern University, Department of Materials Science and Engineering, Evanston, Illinois 60208
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Abstract

Crystalline thin films of silicon nitride have been grown on a variety of substrates by microwave plasma-enhanced chemical vapor deposition using N2, O2, and CH4 gases at a temperature of 800 °C. X-ray diffraction and Rutherford backscattering measurements indicate the deposits are stoichiometric silicon nitride with varying amounts of the α and β phases. Scanning electron microscopy imaging indicates β-Si3N4 possesses sixfold symmetry with particle sizes in the submicron range. In one experiment, the silicon necessary for growth comes from the single crystal silicon substrate due to etching/sputtering by the nitrogen plasma. The dependence of the grain size on the methane concentration is investigated. In another experiment, an organo-silicon source, methoxytrimethylsilane, is used to grow silicon nitride with controlled introduction of the silicon necessary for growth. Thin crystalline films are deposited at rates of 0.1 μm/h as determined by profilometry. A growth mechanism for both cases is proposed.

Type
Articles
Information
Journal of Materials Research , Volume 9 , Issue 9 , September 1994 , pp. 2341 - 2348
Copyright
Copyright © Materials Research Society 1994

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