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Evolution of the Sn/Ni–8.0 at.%V interfacial reaction paths

Published online by Cambridge University Press:  23 September 2011

Sinn-Wen Chen*
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu 300, Taiwan
Yu-Ren Lin
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu 300, Taiwan
Hsin-Jay Wu
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu 300, Taiwan
Ru-Bo Chang
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu 300, Taiwan
Chia-Ming Hsu
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu 300, Taiwan
Hong-Ming Lin
Affiliation:
Department of Materials Engineering, Tatung University, Taipei 104, Taiwan
*
a)Address all correspondence to this author. e-mail: swchen@mx.nthu.edu.tw
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Abstract

Sn/Ni–8.0 at.%V (Ni–7.0 wt%V) couples are prepared and the interfacial reactions at 210 and 250 °C are examined. In the early stage of reaction at 250 °C, a T phase is formed as a result of fast diffusion of Sn into the Ni–8.0 at.%V substrate. With a longer reaction, the outer region of the T phase transforms to a Ni-depletion layer, which has not been observed previously. Both the T phase and the Ni-depletion layer are analyzed using transmission electronic microscopy. This newly found Ni-depletion layer is composed of Sn and nanosize “VSn2(V2Sn3)” particulates. The solid/solid reaction paths in the Sn/Ni–8.0 at.%V couples evolve from Sn/T/Ni–V, Sn/Ni3Sn4/T/Ni–V to Sn/Ni3Sn4/VSn2(V2Sn3). During the liquid/solid reactions, the paths are liquid/T/Ni–V, liquid/liquid + Ni3Sn4/T/Ni–V, liquid/liquid + Ni3Sn4/liquid + VSn2(V2Sn3)/T/Ni–V, and liquid/liquid + Ni3Sn4/liquid + VSn2(V2Sn3).

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Copyright
Copyright © Materials Research Society 2011

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Supplementary material: File

Chen Supplementary Table

Table 1: The EPMA measurements along the two different layers in the Sn/Ni-8.0at%V couples reacted at 250oC for 24 hours.

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