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Effect of dose stoichiometry on the structure of vapor-deposited polyimide thin films

Published online by Cambridge University Press:  03 March 2011

R.G. Pethe ,
C.M. Carlin ,
H.H. Patterson  and
W.N. Unertl
R.G. Pethe
Affiliation:
Laboratory for Surface Science and Technology, Sawyer Research Center, University of Maine, Orono, Maine 04469
C.M. Carlin
Affiliation:
Laboratory for Surface Science and Technology, Sawyer Research Center, University of Maine, Orono, Maine 04469
H.H. Patterson
Affiliation:
Laboratory for Surface Science and Technology, Sawyer Research Center, University of Maine, Orono, Maine 04469
W.N. Unertl*
Affiliation:
Laboratory for Surface Science and Technology, Sawyer Research Center, University of Maine, Orono, Maine 04469
*
d)Author to whom correspondence should be addressed.
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Abstract

PMDA-ODA polyimide thin films can be formed by vapor co-deposition of the precursor molecules PMDA (pyromellitic dianhydride) and ODA (4, 4′-oxydianiline) if the resulting polyamic acid film is heated to a 473 to 573 K cure step. We have used laser Raman spectroscopy to study how dose composition, dose rate, and substrate temperature influence the properties of the resulting polyimide films. We find that only doses with excess PMDA produce high quality films. Doses with 1 : 1 stoichiometry or excess ODA produce thermally unstable films that contain imine bonds; these films decompose below 575 K. Dosing onto substrates below 315 K produces the polyamic acid precursor of polyimide. At higher substrate temperatures, films with high defect densities or decomposed films are produced. The equilibrium vapor pressures of ODA and PMDA are reported.

Type
Articles
Information
Journal of Materials Research , Volume 8 , Issue 12 , December 1993 , pp. 3218 - 3228
Copyright
Copyright © Materials Research Society 1993

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