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Effect of aging in hydrogen atmosphere on electrical conductivity of Cu–3at.%Ti alloy

Published online by Cambridge University Press:  31 January 2011

Satoshi Semboshi*
Affiliation:
Department of Materials Science, Osaka Prefecture University, Sakai, Osaka, 599-8531, Japan
Toyohiko J. Konno
Affiliation:
Institute for Materials Research, Tohoku University, Aoba-ku, Sendai, Miyagi, 980-8577, Japan
*
a) Address all correspondence to this author. e-mail: semboshi@mtr.osakafu-u.ac.jp
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Abstract

The electrical conductivities of Cu–3at.%Ti alloys aged at 773 K in a hydrogen atmosphere were investigated as a function of aging time. The electrical conductivity of the quenched alloy, 5.2% International Annealed Copper Standard (IACS), improved with aging time to 66% IACS after 48 h. This was mainly caused by the dilution of the Cu–Ti solid solution in the alloy, which is supported by the fact that the lattice parameter of the face-centered cubic (fcc) phase approaches that of pure Cu by aging in a hydrogen atmosphere.

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Articles
Copyright
Copyright © Materials Research Society 2007

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References

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