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Low-cost eWLB packaging for automotive radar MMICs in the 76–81 GHz range

Published online by Cambridge University Press:  23 January 2013

J. Böck ,
M. Wojnowski ,
C. Wagner ,
H. Knapp ,
W. Hartner ,
M. Treml ,
F. J. Schmückle ,
S. Sinha  and
R. Lachner
J. Böck*
Affiliation:
Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany. Phone: +49 89 234 53292
M. Wojnowski
Affiliation:
Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany. Phone: +49 89 234 53292
C. Wagner
Affiliation:
Danube Integrated Circuit Engineering, Freistädter Straße 400, A-4040 Linz, Austria
H. Knapp
Affiliation:
Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany. Phone: +49 89 234 53292
W. Hartner
Affiliation:
Infineon Technologies AG, Wernerwerkstraße 2, 93049 Regensburg, Germany
M. Treml
Affiliation:
Danube Integrated Circuit Engineering, Freistädter Straße 400, A-4040 Linz, Austria
F. J. Schmückle
Affiliation:
Ferdinand-Braun-Institut für Höchstfrequenztechnik, Gustav-Kirchhof Straße 4, 12489 Berlin, Germany
S. Sinha
Affiliation:
Ferdinand-Braun-Institut für Höchstfrequenztechnik, Gustav-Kirchhof Straße 4, 12489 Berlin, Germany
R. Lachner
Affiliation:
Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany. Phone: +49 89 234 53292
*
Corresponding author: J. Böck Email: josef.boeck@infineon.com
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Abstract

Embedded wafer-level ball grid array (eWLB) is investigated as a low-cost plastic package for automotive radar applications in the 76–81 GHz range. Low transmission losses from chip to package and board are achieved by appropriate circuit and package design. Special measures are taken to effectively remove the heat from the package and to optimize the package process to achieve automotive quality targets. A 77 GHz radar chip set in eWLB package is developed, which can be applied on the system board using standard solder reflow assembly. These radar MMICs provide excellent radio frequency (RF) performance for the next generation automotive radar sensors. The potential for even higher system integration is shown by a radar transceiver with antennas integrated in the eWLB package. These results demonstrate that eWLB technology is an attractive candidate to realize low-cost radar systems and to enable radar safety affordable for everyone in the near future.

Keywords

Radar applicationsAntenna designModeling and measurements
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 5 , Special Issue 1: Special Issue on the German RoCC Project , February 2013 , pp. 25 - 34
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2013

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References

[1]Böck, J. et al. : SiGe bipolar technology for automotive radar applications, in Proc. Bipolar/BiCMOS Circuits and Technology Meeting, 2004, 84–87.Google Scholar
[2]Freundt, D.; Lucas, B.: Long range radar sensor for high-volume driver assistance systems market, in Proc. SAE World Congress and Exhibition, 2008, pp. 117–124.Google Scholar
[3]Brunnbauer, M.; Fürgut, E.; Beer, G.; Meyer, T.: Embedded wafer level ball grid array (eWLB), in Proc. Eighth Electronic Packaging Technology Conference (EPTC), 2006.CrossRefGoogle Scholar
[4]Wojnowski, M. et al. : A 77 GHz SiGe mixer in an embedded wafer level BGA package, in Proc. 58th Electronic Components and Technology Conference (ECTC), 2008.Google Scholar
[5]Wojnowski, M. et al. : Embedded wafer level ball grid array (eWLB) technology for millimeter-wave applications, in Proc. 13th Electronic Packaging Technology Conference (EPTC), 2011.Google Scholar
[6]Knapp, H. et al. : Three-channel 77 GHz automotive radar transmitter in plastic package, in IEEE Radio Frequency Integrated Circuits Symp., 2012.Google Scholar
[7]Wagner, C. et al. : A 77 GHz automotive radar receiver in a wafer level package, in IEEE Radio Frequency Integrated Circuits Symp., 2012.CrossRefGoogle Scholar
[8]Trotta, S. et al. : An RCP Packaged Transceiver Chipset for Automotive LRR and SRR Systems in SiGe BiCMOS Technology. IEEE Trans. Microw. Theory Tech., 60 (3) (2012), 778–794.Google Scholar
[9]Wojnowski, M.; Wagner, C.; Lachner, R.; Böck, J.; Sommer, G.; Pressel, K.: A 77-GHz SiGe single-chip four-channel transceiver module with integrated antennas in embedded wafer-level BGA package, in Proc. 62nd Electronic Components and Technology Conference (ECTC), 2012.Google Scholar