Skip to main content Accessibility help
×
Hostname: page-component-848d4c4894-xfwgj Total loading time: 0 Render date: 2024-06-30T02:32:52.665Z Has data issue: false hasContentIssue false

8 - LCP reliability

Published online by Cambridge University Press:  05 July 2012

Anh-Vu H. Pham
Affiliation:
University of California, Davis
Morgan J. Chen
Affiliation:
Huawei Technologies
Kunia Aihara
Affiliation:
Hirose Electric
Get access

Summary

In this chapter we evaluate the long-term functionality of LCP packages and the protection they offer against external environments. This emerging flex material has ultra-low moisture absorption and permeation close to that of glass. It is an attractive material for making hermetic packages that can provide reliability in a low-cost and lightweight platform. Prototype LCP packages for RF to millimeter-wave frequencies have been reported recently [1–13]; the emphasis in these publications has been primarily on electrical characteristics, with less focus on the reliability aspects. Among the limited list of publications [7–13], some authors claim that LCP can be used for hermetic packages with long-term reliability. Other groups, including the authors of [13], have performed environmental tests such as measuring the water absorption of LCP-cavity packages by submerging them in water. In this chapter, a variety of reliability tests and results on an LCP package will be reported using standard tests recognized as being required for military and commercial products.

A primary hurdle for LCP packaging, or any hermetic packaging in general, is achieving a high-quality lid-seal process. This hurdle can be exacerbated by LCP’s inert chemical properties, which require a careful approach to processing. In a commercially available LCP-molded lead-frame package, a lid may be attached to a base using epoxy. In an epoxy-sealed package, a typical lid attachment process includes a cure cycle, i.e. 5 psi at 165°C for one hour [6]. Moisture can readily and detrimentally pass through this epoxy layer. In ultrasonic-welded packages, the width of the lid interface to the base must be narrow enough for it to accumulate sufficient ultrasonic energy and melt the LCP. In addition, molding small features in LCP is challenging, as the features may be too thin to form a reliable seal. For these various reasons, and given LCP’s short history, it is not surprising that the leak rate and reliability of LCP packages have not been reported extensively in the literature.

Type
Chapter
Information
Publisher: Cambridge University Press
Print publication year: 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Aboush, Z.Benedikt, J.Priday, J.Tasker, R. J.IEEE MTT-S Int. Microwave Symp. DigSan Francisco, 2006Google Scholar
Kanno, H.Ogura, H.Takahashi, K.IEEE MTT-S Int. Microwave Symp. DigPhiladelphia, 2003Google Scholar
Kitazawa, K.Koriyama, S.Minamiue, H.Fujii, M.77-GHz-band surface mountable ceramic packagesIEEE Transactions on Microwave Theory and Techniques 48 2000CrossRefGoogle Scholar
Palazzari, V.Thompson, D.Papageorgiou, N.Proc. 54th Electronic Components and Technology ConfLas Vegas, 2004Google Scholar
Thompson, D.Kingsley, N.Wang, G.Papapolymerou, J.Tentzeris, M.M.IEEE MTT-S Int. Microwave Symp. DigLong Beach CA 2005Google Scholar
Aihara, K.Pham, A.-V.Roman, J.W.Development of molded liquid crystal polymer QFN packages for Ku-band applicationsIMAPS Device PackagingArizona 2006Google Scholar
Aihara, K.Pham, A.-V.IEEE MTT-S Int. Microwave Symp. DigSan Francisco 2006Google Scholar
Aihara, K.Pham, A.-V.Zeeb, D.Flack, T.Stoneham, E.Development of multi-layer liquid crystal polymer Ka-band receiver modulesMicrowave and Optical Technology Letters 51 2009CrossRefGoogle Scholar
Mcgrath, M. P.Aihara, K.Pham, A.-V.Nelson, S. R.IEEE MTT-S Int. Microwave Symp. DigAtlanta, 2008Google Scholar
Chieh, J-C. S.Pham, A-V.Dalrymple, T. W.Kuh, D. G.Garber, B. B.Aihara, K.IEEE MTT-S Int. Microwave Symp. DigAnaheim CA 2010Google Scholar
Aihara, K.Chen, M. J.Pham, A-V.Development of thin-film liquid crystal polymer surface mount packages for Ka-band applicationsIEEE Transactions on Microwave Theory and Techniques 56 2008CrossRefGoogle Scholar
Aihara, K.Chen, M. J.Pham, A-V.
Thompson, D.Tentzeris, M.Papapolymerou, J.Experimental analysis of the water absorption effects on RF/mm-wave active/passive circuits packaged in multilayer organic substratesIEEE Transactions on Advanced Packaging 30 2007CrossRefGoogle Scholar
Pham, A.-V.Laskar, J.Schappacher, J. 1996
2006
http://www.decatur.de/javascript/dew/index.html
Kuang, K.Kim, F.Cahill, S. S.RF and Microwave Microelectronics PackagingSpringer 2010CrossRefGoogle Scholar

Save book to Kindle

To save this book to your Kindle, first ensure coreplatform@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about saving to your Kindle.

Note you can select to save to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be saved to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Available formats
×

Save book to Dropbox

To save content items to your account, please confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your account. Find out more about saving content to Dropbox.

Available formats
×

Save book to Google Drive

To save content items to your account, please confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your account. Find out more about saving content to Google Drive.

Available formats
×