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5 - Electromagnetism: Circuit Applications

Published online by Cambridge University Press:  08 August 2019

Mikael Sahrling
Affiliation:
Tektronix Inc., Oregon
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Summary

The observations from theis applied specifically to integrated circuit situations, where transmission line effects, inductors, capacitors and S-parameters are discussed using the estimation analysis method. Many useful formulae are derived that are used to design real world inductors and estimated parasitic capacitances. Also a brief overview of the connection between the printed circuit board and on-die applications is presented as well as a summary of the current state of detailed modeling of interconnect effects. The theoretical underpinnings behind common shielding techniques is discussed using the estimation analysis in the last part of the chapter. It is followed by design examples and exercises.

Type
Chapter
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Publisher: Cambridge University Press
Print publication year: 2019

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References

5.11 References

Eom, H. J., Electromagnetic Wave Theory for Boundary Value Problems, Berlin, Germany: Springer Verlag, 2004.Google Scholar
David, M. Pozar, Microwave Engineering, 4th edn., Hoboken, NJ: Wiley and Sons, 2012.Google Scholar
Landau, L. D., Lifshitz, Electrodynamics of Continuous Media, 2nd edn., Oxford, UK: Pergamon Press, 1984.Google Scholar
Belevitch, V., “The Lateral Skin Effect in a Flat Conductor,” Philips Technical Review 32, pp. 221231, 1971.Google Scholar
Collin, R. E., Foundations for Microwave Engineering, 2nd edn., IEEE Press on Electromagnetic Wave Theory, Hoboken, NJ: Wiley-IEEE, 1992.Google Scholar
Harrington, R. F., Time-Harmonic Electromagnetic Fields, IEEE Press on Electromagnetic Wave Theory, Hoboken, NJ: Wiley-IEEE, 2001.CrossRefGoogle Scholar
Johnson, Howard W. and Graham, Martin, High-Speed Digital Design: A Handbook of Black Magic, Englewood Cliffs, NJ: Prentice-Hall, 1993.Google Scholar
Landau, L. D. and Lifshitz, E. M., The Classical Theory of Fields, 4th edn., Oxford, UK: Pergamon Press, 1984.Google Scholar
Shadowitz, A., The Electromagnetic Field, Mineola, New York: Dover Press, 2010.Google Scholar
Rojansky, B. and Rojansky, V. J., Electromagnetic Fields and Waves, Mineola, NY: Dover Press, 1979.Google Scholar
Hammond, P. and Sykulski, J. K., Engineering Electromagnetism, Oxford, UK: Oxford University Press, 1994.Google Scholar
Jackson, J. D., Classical Electrodynamics, 3rd edn., Hoboken, NJ: Wiley, 1998.Google Scholar
Balanis, C. A., Advanced Engineering Electromagnetics, 2nd edn., Hoboken, NJ: Wiley, 2012.Google Scholar
Niknejad, A. and Meyer, R., Design, Simulation and Application of Inductors and Transformers for Si RF ICs, New York: Springer, 2000.Google Scholar
Voinigescu, S., High-Frequency Integrated Circuits, Cambridge, UK: Cambridge University Press, 2012.Google Scholar
Rogers, W. M. and Plett, C., Radio-Frequency Integrated Circuits Design, New York: Artech House, 2003.Google Scholar
Darabi, H., Radio Frequency Integrated Circuits and Systems, Cambridge, UK: Cambridge University Press, 2015.Google Scholar
Razavi, B., RF Microelectronics, Englewood Cliffs, 2nd edn., Englewood Cliffs, NJ: Prentice-Hall, 2011.Google Scholar
Martins, R. et al., “Two-Step RF IC Block Synthesis with Pre-Optimized Inductors and Full Layout Generation In-the-loop,” Transactions on Computer-Aided Design of Integrated Circuits and Systems, Early Access.Google Scholar
Zhang, G., Dengi, A., and Carley, L. R., “Automatic Synthesis of a 2.1 GHz SiGe Low Noise Amplifier,” in Proceedings IEEE Radio Frequency Integrated Circuits Symposium. (RFIC), pp. 125–128, 2002.Google Scholar
Tulunay, G. and Balkir, S., “A Synthesis Tool for CMOS RF Low-Noise Amplifiers,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 27, No. 5, pp. 977982, May 2008.Google Scholar
Póvoa, R. et al., “LC-VCO Automatic Synthesis Using Multi-Objective Evolutionary Techniques,” in IEEE International Symposium on Circuits and Systems (ISCAS), pp. 293–296, June 2014.Google Scholar
Chen, L. et al., “A Novel Spiral Inductor Model with a New Parameter-Extraction Approach,” Proc. IEEE International Conference on Microwave and Millimeter Wave Technology, pp. 720–723, 2010.CrossRefGoogle Scholar
Passos, F. et al., “A Wideband Lumped-Element Model for Arbitrarily Shaped Integrated Inductors,” European Conference Circuit Theory Design (ECCTD), 2013.CrossRefGoogle Scholar
Vecchi, V. et al., “A Simple and Complete Circuit Model for the Coupling Between Symmetrical Spiral Inductors in Silicon RF-ICs,” IEEE Radio Frequency Integrated Circuits Symposium, pp. 479–482, 2013.Google Scholar
Ghannam, A. et al., “High-Q SU8 Based Above-IC Inductors for RF Power Devices,” IEEE, Topical Meeting Silicon Monolithic Integrated Circuits RF Systems, pp. 25–28, 2011.Google Scholar
Vancorenland, P., De Ranter, C., Steyaert, M., and Gielen, G., “Optimal RF Design Using Smart Evolutionary Algorithms,” in IEEE, Proceedings Design Automation Conference, pp. 7–10, 2000.CrossRefGoogle Scholar
Nieuwoudt, A., Ragheb, T., and Massoud, Y., “Hierarchical Optimization Methodology for Wideband Low Noise Amplifiers,” in IEEE Proceedings Asia South Pacific Design Automation Conference, Yokohama, pp. 68–73, 2007.Google Scholar
Nieuwoudt, A., Ragheb, T., and Massoud, Y., “Narrow-Band Low Noise Amplifier Synthesis for High-Performance System-on-Chip Design,” Microelectronics Journal, Vol. 38, No. 12, pp. 11231134, Dec. 2007.Google Scholar
Xu, Y., Hsiung, K., Li, X., Pileggi, L., and Boyd, S., “Regular Analog/RF Integrated Circuits Design Using Optimization with Recourse Including Ellipsoidal Uncertainty,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 28, No. 5, pp. 623637, May 2009.Google Scholar
Afacan, E. and Dündar, G., “A Mixed Domain Sizing Approach for RF Circuit Synthesis,” in IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems, pp. 1–4, June 2016.Google Scholar
Liu, B. et al., “An Efficient High-Frequency Linear RF Amplifier Synthesis Method Based on Evolutionary Computation and Machine Learning Techniques,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 31, No. 7, pp. 981993, July 2012.Google Scholar
Ranter, C. et al., “CYCLONE: Automated Design and Layout of RF LC-Oscillators,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 21, pp. 11611170, Oct. 2002.Google Scholar
Ballicchia, M. and Orcioni, S., “Design and Modeling of Optimum Quality Spiral Inductors with Regularization and Debye Approximation,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 29, pp. 16691681, 2010.Google Scholar
González-Echevarría, R. et al., “Automated Generation of the Optimal Performance Trade-Offs of Integrated Inductors,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 33, No. 8, pp. 12691273, August 2014.Google Scholar
González-Echevarría, R. et al., “An Automated Design Methodology of RF Circuits by Using Pareto-Optimal Fronts of EM-Simulated Inductors,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 36, No. 1, pp. 1526, Jan. 2017.CrossRefGoogle Scholar
Bontzios, Y. et al., “Prospects of 3D Inductors on Through Silicon Vias Processes for 3D ICs,” IEEE International Conference on VLSI System-On-Chip, pp. 90–93, 2011.CrossRefGoogle Scholar
Salah, K. et al., “A Closed Form Expression for TSV-Based On-Chip Spiral Inductor,” IEEE International Symposium on Circuits and Systems, pp. 2325–2328, 2012.Google Scholar
Yahalom, G. et al., “A Vertical Solenoid Inductor for Noise Coupling Minimization in 3D-IC,” IEEE Radio Frequency International Symposium on Circuits and Systems, pp. 55–58, 2015.Google Scholar
Kim, B. and Cho, S., “Recent Advances in TSV Inductors for 3D IC Technology,” IEEE Int. SoC Design Conference, pp. 29–30, 2016.Google Scholar
Mohan, S., “The Design Modeling and Optimization of on Hip to Chip Inductor and Transformer Circuits,” Ph.D. Dissertation, Stanford University, 1999.Google Scholar

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