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1 - Introduction

Published online by Cambridge University Press:  05 February 2014

Stepan Lucyszyn
Affiliation:
Imperial College of Science, Technology and Medicine, London
Stepan Lucyszyn
Affiliation:
Imperial College of Science, Technology and Medicine, London
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Summary

Introduction

Radio frequency microelectromechanical systems (RF MEMS) can offer unsurpassed RF performance over more conventional solid-state electronic devices and can help to implement advancements within a broad range of applications; from ubiquitous smart sensor networks to mobile handsets. Moreover, they can substantially reduce the size, weight and cost of reconfigurable subsystems; making this an important enabling technology for the twenty-first century.

MEMS technologies are already firmly established within high-volume commercial markets. Examples include inertial sensors/accelerometers (e.g. used in car airbag sensors, gaming accessories and mobile handsets), disk drive read/write heads, ink-jet printer nozzles, microphones and digital light projectors. In contrast, MEMS for RF applications has been relatively slow to move out of the laboratory and into commercial products. Indeed, the first RF MEMS papers started to appear over three decades ago. For example, a truly landmark paper was published on electrostatically actuated cantilever-type ohmic contact switches back in 1979 [1]. Over the past decade, however, a raft of interesting components and circuits has been demonstrated. Some of these developments have been reviewed from the perspective of enabling technologies [2], while the real founding principles have been described in some detail within the established textbooks by Santos [3], Rebeiz [4] and Varadan et al. [5]. More recent articles of noteworthy merit have also appeared on technologies, testing, reliability and applications associated with general RF MEMS [6–8].

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Advanced RF MEMS , pp. 1 - 22
Publisher: Cambridge University Press
Print publication year: 2010

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References

Peterson, K. E., “Micromechanical membrane switches on silicon”, IBM J. Res. Dev., vol. 23, no. 4, pp. 376–85, 1979CrossRefGoogle Scholar
Lucyszyn, S., “Review of radio frequency microelectromechanical systems (RF MEMS) technology”, IEE Proc. – Sci. Meas. Technol., vol. 151, no. 2, pp. 93–103, Mar. 2004CrossRefGoogle Scholar
Santos, H. J., RF MEMS Circuit Design for Wireless Communication, Artech House, 2002
Rebeiz, G. M., RF MEMS: Theory, Design and Technology, Wiley, 2003CrossRefGoogle Scholar
Varadan, V. K., Vinoy, K. J. and Jose, K. A., RF MEMS and Their Applications, Wiley, 2003Google Scholar
Gammem, P., Fischer, G. and Bouchaud, J., “RF MEMS and NEMS technology, devices and applications”, AT&T Tech. J., vol. 10, no. 3, pp. 29–59, Nov. 2005Google Scholar
Goldsmith, C., Maciel, J. and McKillop, J., “Demonstrating reliability”, IEEE Microw. Mag., pp. 56–60, Dec. 2007CrossRefGoogle Scholar
Ebel, J. L., Hyman, D. J. and Newman, H. S., “RF MEMS testing – beyond the S-parameters”, IEEE Microw. Mag., pp. 76–88, Dec. 2007CrossRefGoogle Scholar
Sorrentino, R., “MEMS-based reconfigurable reflectarrays”, EurAAP and IET The Second European Conference on Antennas and Propagation (EuCAP 2007), Edinburgh, UK, Nov. 2007Google Scholar
Dahlmann, G. W., Yeatman, E. M., Young, P. R., Robertson, I. D. and Lucyszyn, S., “Fabrication, RF characteristics and mechanical stability of self-assembled 3D microwave inductors”, Sens. Actuators A, Phys., Elsevier Science, vol. 97–98, pp. 215–20, Apr. 2002CrossRefGoogle Scholar
Pranonsatit, S. and Lucyszyn, S., “Self-assembled screen-printed microwave inductors”, IEE Electron. Lett., vol. 41, no. 23, pp. 1287–8, Nov. 2005CrossRefGoogle Scholar
Larsson, M. P. and Lucyszyn, S., “A micromachined separable RF connector fabricated using low-resistivity silicon”, J. Micromech. Microeng., vol. 16, pp. 2021–33, Aug. 2006CrossRefGoogle Scholar
Lubecke, V. M., McGrath, W. R., Stimson, P. A., and Rutledge, D. B., “Micromechanical tuning elements in a 620-GHz monolithic integrated circuit”, IEEE Trans. Microw. Theory Tech., vol. 46, no. 12, pp. 2098–103, Dec. 1998CrossRefGoogle Scholar
Lee, J. S. and Lucyszyn, S., “A micromachined refreshable Braille cell”, IEEE/ASME J. Microelectromechan. Syst., vol. 14, no. 4, pp. 673–682, Aug. 2005Google Scholar
Lee, J. S. and Lucyszyn, S., “Design and pressure analysis for bulk-micromachined electrothermal hydraulic microactuators using a PCM”, Sens. Actuators A, Phys., vol. 133, no. 2, pp. 294–300, Feb. 2007CrossRefGoogle Scholar
Lee, J. S. and Lucyszyn, S., “Thermal analysis for bulk-micromachined electrothermal hydraulic microactuators using a phase change material”, Sens. Actuators A, Phys., vol. 135, no. 2, pp. 731–9, Apr. 2007CrossRefGoogle Scholar
Choi, J.-Y., Ruan, J., Coccetti, F. and Lucyszyn, S., “Three-dimensional RF MEMS switch for power applications,” IEEE Trans. Ind. Electron., vol. 56, no. 4, pp. 1031–9, Apr. 2009CrossRefGoogle Scholar
Grant, P. D. and Denhoff, M. W., “A comparison between RF MEMS switches and Semiconductor switches”, Proc. IEEE International Conference on MEMS, NANO and Smart Systems (ICMENS’04), pp. 515–21, Aug. 2004
Kim, J.-I. and Peroulis, D., “Tunable MEMS spiral inductors with optimized RF performance and integrated large-displacement electrothermal actuators”, IEEE Trans. Microw. Theory Tech., vol. 57, no. 9, pp. 2276–83, Sep. 2009Google Scholar
Chiao, J.-C., Fu, Y., Choudhury, D. and Lin, L-Y, “MEMS millimetre-wave components”, Proceedins of the IEEE MTT-S International Microwave Symposium, Anaheim, CA, pp. 463–6, Jun. 1999Google Scholar
Lucyszyn, S., Miyaguchi, K., Jiang, H. W., Robertson, I. D., Fisher, G., Lord, A. and Choi, J.-Y., “Micromachined RF-coupled cantilever inverted-microstrip millimeter-wave filters”, J. Microelectromechan. Syst., vol. 17, no. 3, pp. 767–76, Jun. 2008CrossRefGoogle Scholar
Pranonsatit, S. and Lucyszyn, S., “Micromachined screen printing (MaSPrint) technology for RF MEMS applications”, 10th IEEE High Frequency Postgraduate Student Colloquium (10th HF-PgC) Digest, ISBN: 0-7803-9500-X, Leeds, UK, pp. 3–6, Sep. 2005
Robertson, I. D. and Lucyszyn, S., eds., “RFIC and MMIC Design and Technology”, English Version Published by the IEE, ISBN: 0-85296-786-1, London, Nov. 2001; Chinese Translation Published by the Publishing House of Electronics Industry, ISBN: 978-7-121-03830-3, Beijing, China, Feb. 2007
Lucyszyn, S., Silva, S. R. P., Robertson, I. D., Collier, R. J., Jastrzebski, A. K., Thayne, I. G. and Beaumont, S. P., “Terahertz multi-chip module (T-MCM) technology for the 21st Century?”, IEE Colloquium Digest on Multi-Chip Modules and RFICs, London, UK, pp. 6/1–8, May 1998Google Scholar
Lucyszyn, S., Wang, Q. H. and Robertson, I. D., “0.1 THz rectangular waveguide on GaAs semi-insulating substrate”, IEE Electron. Lett., vol. 31, no. 9, pp. 721–2, Apr. 1995CrossRefGoogle Scholar
Lucyszyn, S., Budimir, D., Wang, Q. H. and Robertson, I. D., “Design of compact monolithic dielectric-filled metal-pipe rectangular waveguides for millimetre-wave applications”, IEE Proc. – Microw. Antennas Propagation, vol. 143, no. 5, pp. 451–3, Oct. 1996CrossRefGoogle Scholar
Lucyszyn, S., “The future of on-chip terahertz metal-pipe rectangular waveguides implemented using micromachining and multilayer technologies”, IEE Colloquium Digest on Terahertz Technology and its Applications, London, UK, pp. 10/1–10, Apr. 1997Google Scholar
Aftanasar, M. S., Young, P. R., Robertson, I. D., Minalgiene, J. and Lucyszyn, S., “Photoimageable thick-film millimetre-wave metal-pipe rectangular waveguides”, IEE Electron. Lett., vol. 37, no. 18, pp. 1122–3, Aug. 2001CrossRefGoogle Scholar
Aftanasar, M. S., Young, P. R., Robertson, I. D. and Lucyszyn, S., “Fabrication of dielectric-filled rectangular waveguide using thick-film processing”, 6th IEEE High Frequency Postgraduate Colloquium Digest, ISBN: 0-7803-7118-6, Cardiff, UK, pp. 82–87, Sep. 2001CrossRefGoogle Scholar
Shafique, M. F., Saeed, K., Steenson, D. P. and Robertson, I. D., “Laser prototyping of microwave circuits in LTCC technology”, IEEE Trans. Microw. Theory Tech., vol. 57, no. 12, Dec. 2009CrossRefGoogle Scholar
Beilenhoff, K., Mutamba, C., Pfeiffer, J., Peerings, J., Simon, A., Lin, C. and Hartnagel, H. L., “III-V semiconductor structuring for mm and sub-mm waves”, Workshop M-FrW3 European Micro-Wave Week, Munich, Germany, Oct. 1999
Yeatman, E. M., Holmes, A. S., Lucyszyn, S. and Dahlmann, G., “Design of a micro-electro-mechanical system (MEMS) RF technology for a phase shifter suitable for space radar applications”, Final Report, Aug. 2001Google Scholar
Brown, E. R., Cohen, A. L., Bang, C. A., Lockard, M. S., Byrne, B. W., Vandelli, N. M., McPherson, D. S. and Zhang, G., “Characteristics of microfabricated rectangular coax in the Ka band”, Microw. Opt. Technol. Lett., vol. 40, no. 5, pp. 365–8, Mar. 2004CrossRefGoogle Scholar
Peroulis, D., Pacheco, S. P., Sarabandi, K. and Katehi, L. P. B., “Electromechanical considerations in developing low-voltage RF MEMS switches”, IEEE Trans. Microw. Theory Tech., vol. 51, no. 1, pp. 259–70, Jan. 2003CrossRefGoogle Scholar
Pranonsatit, S., Holmes, A. S., Robertson, I. D. and Lucyszyn, S., “Single-pole eight-throw RF MEMS rotary switch”, J. Microelectromechan. Syst., vol. 15, no. 6, pp. 1735–44, Dec. 2006CrossRefGoogle Scholar
Girbau, D., Pradell, L., Lázaro, A. and Nebot, À., “Electrothermally actuated RF MEMS switches suspended on a low-resistivity substrate”, J. Microelectromechan. Syst., vol. 16, no. 5, pp. 1061–70, Oct. 2007CrossRefGoogle Scholar
Baek, C.-W., Song, S., Park, J.-H., Lee, S., Kim, J.-M., Choi, W., Cheon, C., Kim, Y.-K. and Kwon, Y., “A V-band micromachined 2-D beam-steering antenna driven by magnetic force with polymer-based hinges”, IEEE Trans. Microw. Theory Tech., vol. 51, no. 1, pp. 325–31, Jan. 2003CrossRefGoogle Scholar
Lucyszyn, S., “Microwave characterization of nickel”, TEA PIERS Online Journal, ISSN 1931–7360, vol. 4, no. 6, pp. 686–90, Jun. 2008CrossRefGoogle Scholar
Bouchaud, J., Knoblich, B., Tilmans, H., Coccetti, F. and El Fatatry, A., “RF MEMS roadmap”, 37th European Microwave Conference Proceedings, Munich, Germany, pp. 1141–4, Oct. 2007Google Scholar
Goldsmith, C., Lin, T.-H., Powers, B., Wu, W.-R. and Norvell, B., “Micromechanical membrane switches for microwave applications”, IEEE MTT-S International Microwave Symposium Proceedings, Orlando, FL, pp. 91–94, May 1995Google Scholar
Pacheco, S. P., Katehi, L. P. B. and Nguyen, C. T.-C., “Design of low actuation voltage RF MEMS switch”, Proceedings of IEEE MTT-S International Microwave Symposium, Boston, MA, pp. 165–8, Jun. 2000Google Scholar
Ruan, M., Tam, G., Vaitkus, R., Wheeler, C. and Shen, J., “Micro magnetic latching RF switches”. Proceedings Wireless Design Conference, London, UK, pp. 59–66, May 2002Google Scholar
Blondy, P., Mercier, D., Cros, D., Guillon, P., Rey, P., Charvet, P., Diem, B., Zanchi, C., Lapierre, L., Sombrin, J. and Quoirin, J. B., “Packaged millimetre wave thermal MEMS switch”. Proceedings 31st European Microwave Conference, London, UK, pp. 283–6, Sep. 2001Google Scholar
Seeger, J. I. and Crary, S. B., “Stabilization of electrostatically actuated mechanical devices”, Proceedings IEEE International Conference on Solid-State Sensors and Actuators (Transducers), Chicago, IL, pp. 1130–6, Jun. 1997Google Scholar
Borwick, R. L., Stupar, P. A., DeNatale, J. F., Anderson, R. and Erlandson, R., “Variable MEMS capacitors implemented into RF filter systems”, IEEE Trans. Microw. Theory Tech., vol. 51, no. 1, pp. 315–19, Jan. 2003CrossRefGoogle Scholar
Harsh, K. F., Su, B., Zhang, W., Bright, V. M. and Lee, Y. C., “The realization and design considerations of a flip-chip integrated MEMS tunable capacitor”, Sens. Actuators A, Phys., vol. 80, pp. 108–18, 2000CrossRefGoogle Scholar
Pu, S. H., Holmes, A. S., Yeatman, E. M., Papavassiliou, C. and Lucyszyn, S., “Stable zipping RF MEMS varactors”, J. Micromechan. Microeng., vol. 20, Mar. 2010CrossRefGoogle Scholar
Young, D. J. and Boser, B. E., “A micromachined variable capacitor for monolithic low-noise VCOs”, Solid-State Sensor and Actuator Workshop Technical Digest, Hilton Head Island, SC, pp. 86–89, 1996Google Scholar
Hung, E. S. and Senturia, S. D., “Tunable capacitors with programmable capacitance-voltage characteristic”, Solid-State Sensor and Actuator Workshop Technical Digest, Hilton Head Island, SC, pp. 292–5, 1998Google Scholar
Yoon, J.-B. and Nguyen, C. T. C., “A high-Q tunable micromechanical capacitor with movable dielectric for RF applications”, International Electron Devices Meeting, pp. 489–92, 2000Google Scholar
Zou, J., Liu, C., Schutt-Aine, J., Chen, J. and Kang, S.-M., “Development of a wide tuning range MEMS tunable capacitor for wireless communication systems”, International Electron Devices Meeting, pp. 403–6, 2000Google Scholar
Park, J. Y., Yee, Y. J., Nam, H. J. and Bu, J. U., “Micromachined RF MEMS tunable capacitors using piezoelectric actuators”, IEEE/MTT-S International Microwave Symposium, pp. 2111–14, 2001Google Scholar
Dussopt, L. and Rebeiz, G. M., “High-Q millimeter-wave MEMS varactors: extended tuning range and discrete-position designs”, IEEE/MTT-S International Microwave Symposium, pp. 1205–8, 2002Google Scholar
Ionis, G. V., Dec, A. and Suyama, K., “A zipper-action differential micro-mechanical tunable capacitor”, IEEE International Conference on Micro-Electro-Mechanical Systems, pp. 29–32, 2002Google Scholar
Muldavin, J., Bozler, C., Rabe, S. and Keast, C., “Large tuning range analog and multi-bit MEMS varactors”, IEEE MTT-S International Microwave Symposium, pp. 1919–22, 2004Google Scholar
Rijks, T. G. S. M., van Beek, J. T. M., Steeneken, P. G., Ulenaers, M. J. E., De Coster, J. and Puers, R., “RF MEMS tunable capacitors with large tuning ratio”, IEEE International Conference on Micro-Electro-Mechanical Systems, pp. 777–80, 2004Google Scholar
Nguyen, H. D., Hah, D., Patterson, P. R., Chao, R., Piyawattanametha, W., Lau, E. K. and Wu, M. C., “Angular vertical comb-driven tunable capacitor with high-tuning capabilities”, J. Microelectromechan. Syst., vol. 13, pp. 406–13, 2004CrossRefGoogle Scholar
Lee, C.-Y. and Kim, E. S., “Piezoelectrically actuated tunable capacitor”, J. Microelectromechan. Syst., vol. 15, pp. 745–55, 2006CrossRefGoogle Scholar
Chiao, J. C., Fu, Y., Chio, I. M., Delisio, M. and Lin, L. Y., “MEMS reconfigurable Vee antenna”, IEEE MTT-S International Microwave Symposium, Anaheim, CA, pp. 1515–18, Jun. 1999Google Scholar
Kim, M., Hacker, J. B., Mihailovich, R. A. and DeNatale, J. F., “A monolithic MEMS switched dual-path power amplifier”, IEEE Microw. Compon. Lett., vol. 11, no. 7, pp. 285–6, Jul. 2001CrossRefGoogle Scholar
Cetiner, B. A., Qian, J. Y., Chang, H. P., Bachman, M., Li, G. P. and De Flaviis, F., “Monolithic integration of RF MEMS switches with a diversity antenna on PCB substrate”, IEEE Trans. Microw. Theory Tech., vol. 51, no. 1, pp. 332–5, Jan. 2003CrossRefGoogle Scholar
Pranonsatit, S.Lucyszyn, S., “RF-MEMS activities in Europe”, Microwave Workshops and Exhibition (MWE 2005) Digest, Yokohama, Japan, Nov. 2005
Rebeiz, G. M., “RF MEMS activities in USA”, Microwave Workshops and Exhibition (MWE 2005) Digest, Yokohama, Japan, Nov. 2005
Mizuno, K., Sangawa, U., Seki, T. and Nishino, T., “RF-MEMS activities in Japan”, Microwave Workshops and Exhibition (MWE 2005) Digest, Yokohama, Japan, Nov. 2005
Mah, M., “RF-MEMS activities in Asia”, Microwave Workshops and Exhibition (MWE 2005) Digest, Yokohama, Japan, Nov. 2005

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  • Introduction
    • By Stepan Lucyszyn, Imperial College of Science, Technology and Medicine, London
  • Edited by Stepan Lucyszyn, Imperial College of Science, Technology and Medicine, London
  • Book: Advanced RF MEMS
  • Online publication: 05 February 2014
  • Chapter DOI: https://doi.org/10.1017/CBO9780511781995.002
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  • Introduction
    • By Stepan Lucyszyn, Imperial College of Science, Technology and Medicine, London
  • Edited by Stepan Lucyszyn, Imperial College of Science, Technology and Medicine, London
  • Book: Advanced RF MEMS
  • Online publication: 05 February 2014
  • Chapter DOI: https://doi.org/10.1017/CBO9780511781995.002
Available formats
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Save book to Google Drive

To save content items to your account, please confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your account. Find out more about saving content to Google Drive.

  • Introduction
    • By Stepan Lucyszyn, Imperial College of Science, Technology and Medicine, London
  • Edited by Stepan Lucyszyn, Imperial College of Science, Technology and Medicine, London
  • Book: Advanced RF MEMS
  • Online publication: 05 February 2014
  • Chapter DOI: https://doi.org/10.1017/CBO9780511781995.002
Available formats
×