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Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration

Published online by Cambridge University Press:  17 March 2011

Y. Kwon ,
J.-Q. Lu ,
R. P. Kraft ,
J. F. McDonald ,
R.J. Gutmann  and
T. S. Cale
Y. Kwon
Affiliation:
Focus Center- New York, Rensselaer: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180
J.-Q. Lu
Affiliation:
Focus Center- New York, Rensselaer: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180
R. P. Kraft
Affiliation:
Focus Center- New York, Rensselaer: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180
J. F. McDonald
Affiliation:
Focus Center- New York, Rensselaer: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180
R.J. Gutmann
Affiliation:
Focus Center- New York, Rensselaer: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180
T. S. Cale
Affiliation:
Focus Center- New York, Rensselaer: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180
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Abstract

A key process in our approach to monolithic three-dimensional (3D) integration is the bonding of 200-mm wafers using dielectric polymer thin films as bonding glues. After discussing the desired properties of polymer thin films, we describe how bonding protocols are evaluated using silicon and glass wafers. After bonding, the fraction of bonded area was inspected optically and a razor blade method was used to indicate bonding strength. Thermal stability and bonding integrity were evaluated using thermal cycling and backside grinding and polishing. To date, we have studied benzocyclobutene (BCB), Flare™, and methylsilsesquioxane (MSSQ) and Parylene-N as bonding glues. Wafer pairs bonded using BCB showed a larger fraction of bonded area, and those using Flare indicated higher thermal stability. Both BCB and Flare glues provided good bonding integrity after backside grinding tests. Changes in the chemical structures of BCB and Flare glue during bonding were analyzed using FTIR in order to understand the bonding mechanism and to improve the bonding process.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 710: Symposia DD – Polymer Interfaces and Thin Films , 2001 , DD12.18.1
Copyright
Copyright © Materials Research Society 2002

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References

REFERENCES

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