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Development of Electrochemical Copper Deposition Screening Methodologies for Next Generation Additive Selection

Published online by Cambridge University Press:  10 August 2011

Kevin Ryan ,
Kathleen Dunn  and
Jobert van Eisden
Kevin Ryan
Affiliation:
College of Nanoscale Science and Engineering at SUNY Albany, 255 Fuller Rd, Albany, NY 12222, U.S.A.
Kathleen Dunn
Affiliation:
College of Nanoscale Science and Engineering at SUNY Albany, 255 Fuller Rd, Albany, NY 12222, U.S.A.
Jobert van Eisden
Affiliation:
Atotech USA, 255 Fuller Rd, Albany, NY 12222, U.S.A.
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Abstract

To reduce time-to-knowledge and costs associated with wafer scale processing a laboratory scale copper electrochemical deposition (ECD) system was developed for screening new organic additives which promote bottom-up fill in interconnect trenches and vias. This new setup enables working process conditions and functionality trends to be identified for open source and proprietary suppressors and levelers at leading edge feature sizes (sub 50nm). The laboratory results can then be compared to the in-line wafer scale plating tool results to ensure their compatibility. A reliable laboratory setup that can mimic the dynamic conditions found inside the wafer scale plating tool will enable the main objective of this work to be efficiently realized. The main objective is to test two previously published models describing copper fill inside the trenches by bridging the gap between fundamental electrochemical measurements and wafer scale plating results. To date this work will focus on the reliability and transferability of plating results between the laboratory setup and a wafer scale plating tool and present preliminary data using gap fill and bottom-up growth ratio as performance metrics.

Keywords

electrodepositionCuadditives
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1335: Symposium O – Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics , 2011 , mrss11-1335-o09-27
Copyright
Copyright © Materials Research Society 2011

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