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Effect of Thickness and Annealing on Stress in Tantalum and Tantalum Nitride Thin Film Hard Coatings

Published online by Cambridge University Press:  15 February 2011

Ranjana Saha ,
Rama B. Inturi  and
John A. Barnard
Ranjana Saha
Affiliation:
Department of Metallurgical and Materials Engineering, The University of Alabama, Tuscaloosa, AL 35487–0202.
Rama B. Inturi
Affiliation:
Department of Metallurgical and Materials Engineering, The University of Alabama, Tuscaloosa, AL 35487–0202.
John A. Barnard
Affiliation:
Department of Metallurgical and Materials Engineering, The University of Alabama, Tuscaloosa, AL 35487–0202.
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Abstract

An understanding of the relationship between stress and the other properties of thin films is extremely useful in the design of hard coatings for long term performance. In our earlier study, sputtered Ta and Ta(N) films were found to exhibit promising hard coating properties. For example, nano hardness as high as 30 GPa was observed in the nitride (pN2 = 0.100 mTorr) films. In this work, we study the variation in the stress in these films with respect to film thickness and annealing. Films in six different thicknesses (50, 250, 350, 500, 750, and 1000 nm) were deposited on oxide coated Si (111) wafers. Stresses in the films in the as-deposited state and as a function of temperature (300°C) were determined using a thin film stress measuring unit.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 436: Symposium CC – Thin Films Stresses and Mechanical Properties VI , 1996 , 529
Copyright
Copyright © Materials Research Society 1997

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