5 results
Effect of Wettability of Poly Silicon on CMP Behavior
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- Journal:
- MRS Online Proceedings Library Archive / Volume 991 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0991-C09-06
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- 2007
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The Adhesion of Pad Particles on Wafer Surfaces during Cu CMP
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- Journal:
- MRS Online Proceedings Library Archive / Volume 867 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, W1.9
- Print publication:
- 2005
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Frictional behavior and particle adhesion of abrasive particles during Cu CMP
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- Journal:
- MRS Online Proceedings Library Archive / Volume 867 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, W6.2
- Print publication:
- 2005
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Effect of Corrosion Inhibitor (BTA) in Citric Acid based Slurry on Cu CMP
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- Journal:
- MRS Online Proceedings Library Archive / Volume 867 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, W1.3
- Print publication:
- 2005
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The Adsorption Behaviors of Citric Acid on Abrasive Particles in Cu CMP Slurry
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- Journal:
- MRS Online Proceedings Library Archive / Volume 867 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, W7.5
- Print publication:
- 2005
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