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We present a method to realize nanoelectromechanical systems (NEMS) resonator structures from carbon nanotubes (CNT)/metal layered composite structures. The method utilizes a self aligning process over a near 2-D CNT network on GaAs to realize resonator structures and a highly selective etchant, a standard citric acid/hydrogen peroxide solution, to achieve release of NEMS resonators from the substrate. We find this method along with critical point drying (CPD) to yield robust hybrid CNT/metal resonator structures with fundamental resonant frequencies in the 10 MHz range. With high reflectivity, conductivity, and bio-compatibility of metals, this fabrication method along with possible benefits of CNT have many application possibilities.
In the thin film transistor fabrication process, tin doped indium oxide (ITO) or zinc doped indium oxide (IZO) film can be easily exposed to hydrogen-containing plasma during the deposition of silicon nitride (SiNx) film. By this exposure, ITO or IZO can be easily reduced into its corresponding metallic element such as indium, which degrades the optical transmittance and the conductivity. In this study, SiNx was deposited onto ITO or IZO film, and the oxygen reduction of ITO or IZO during PECVD SiNx deposition was analyzed to clarify this phenomenon. The oxygen reduction during PECVD SiNx deposition is mainly induced by decomposed NH3 gas. However, the progress of ITO reduction is different from that of IZO reduction, due to the different atomic composition of In2O3 in the composite and the different critical temperature of reduction initiation between indium oxide, tin oxide, and zinc oxide.
The effect of a post plasma treatment on the dielectric properties and reliability of fluorine doped silicon oxide (SiOF) films deposited by electron cyclotron resonance chemical vapor deposition (ECRCVD) was studied. Also, the thermal stability of an electrodeposited Cu / sputtered Ta interconnect system with SiOF intermetal dielectrics was examined by annealing in a vacuum furnace. The stability of the dielectric constant of SiOF films was improved by O2 post plasma treatment. Surface modification by the plasma treatment was effective in prevention of water absorption. The Cu/Ta/SiOF/Si system was thermally stable at least up to 500°C for 3h. For the Cu/Ta/SiOF/Si multilayer structure, the plasma treatment seemed to play a big role in suppressing the interdiffusion between SiOF and metal interconnects. By C-V measurement, the electrical stability of the Cu/Ta/SiOF/Si multilayer structure was found to be stable up to 500°C for 2 h.
The effect of the post plasma treatment on the dielectric properties and reliability of fluorine doped silicon oxide (SiOF) films was studied. Also, the thermal stability of a Cu/WN interconnect system with SiOF intermetal dielectrics was examined by RTA. The surface roughness of SiOF films increased with the increasing plasma treatment power due to ion bombardment effect during the plasma treatment. As the plasma treatment power increased, the dielectric constant increased from 3.16 to 3.43, while the change in the relative dielectric constant of the plasma treated films by the boiling treatment was decreased in magnitude. Furthermore, the chemical properties of the plasma treated SiOF films near the top layer tend to resemble those of thermal oxides by the plasma treatment of sufficient power because of the reduction in the Si-F bonding in the films. In the case of Cu/WN/SiOF/Si multilayer structure, surface oxidation and densification due to the plasma treatment seemed to play an important role in protecting the interdiffusion between SiOF and metal interconnects.
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