7 results
Initial interfacial reaction layers formed in Sn–3.5Ag solder/electroless Ni–P plated Cu substrate system
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- Journal:
- Journal of Materials Research / Volume 23 / Issue 8 / August 2008
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2195-2201
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- August 2008
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Interfacial reactions and mechanical properties of In–48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows
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- Journal:
- Journal of Materials Research / Volume 23 / Issue 6 / June 2008
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1631-1641
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- June 2008
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Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging
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- Journal:
- Journal of Materials Research / Volume 22 / Issue 10 / October 2007
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2817-2824
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- October 2007
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Reliability analysis of Au–Sn flip-chip solder bump fabricated by co-electroplating
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- Journal:
- Journal of Materials Research / Volume 22 / Issue 5 / May 2007
- Published online by Cambridge University Press:
- 03 March 2011, pp. 1219-1229
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- May 2007
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Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C
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- Journal:
- Journal of Materials Research / Volume 21 / Issue 12 / December 2006
- Published online by Cambridge University Press:
- 03 March 2011, pp. 3196-3204
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- December 2006
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Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder
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- Journal:
- Journal of Materials Research / Volume 21 / Issue 6 / June 2006
- Published online by Cambridge University Press:
- 01 June 2006, pp. 1590-1599
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- June 2006
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Development of YBCO film approached by TFA-MOD method using the Y2Ba1Cu1Ox and Ba3Cu5O8 powders
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- Journal:
- MRS Online Proceedings Library Archive / Volume 946 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0946-HH08-06
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- 2006
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