CVD experiments were conducted using (Me3SiCH2)4Ti, Bis(2,4-dimethylpentadienyl) titanium, Cl3TiMe, (Me3SiCH2TiCl3 to evaluate their potential as Ti precursor compounds. Only Me3SiCH2TiCl3 was suitable for atmospheric CVD applications. Uniform thin films of polycrystalline TiC were deposited using Me3SiCH2TiCl3 in an argon ambient between 700 °C and 800 °C. A mechanism involving initial loss of Me3SiCl to generate a titanium carbene intermediate is proposed. Thin films of TiC deposited on Si were characterized using XRD and AES. Depth profile line shape analysis showed only TiC and elemental Si in the interfacial region. XRD indicates some titanium silicide is formed at 800 °C. In a hydrogen ambient, hydrogenolysis of the alkyl group occurs and very poor film growth results were obtained.