16 results
In Situ Elastic Strain Measurements—Diffraction and Spectroscopy
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- Journal:
- MRS Bulletin / Volume 35 / Issue 5 / May 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 368-374
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- May 2010
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In situ compression tests on micron-sized silicon pillars by Raman microscopy—Stress measurements and deformation analysis
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- Journal:
- Journal of Materials Research / Volume 23 / Issue 11 / November 2008
- Published online by Cambridge University Press:
- 31 January 2011, pp. 3040-3047
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- November 2008
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Electromigration-Induced Plastic Deformation in Cu Damascene Interconnect Lines as Revealed by Synchrotron X-Ray Microdiffraction
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F06-05
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- 2006
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X-Ray Diffraction as a Probe for Elastic Strain: Micro- and Nanoscale Investigation of Thin Metal Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 840 / 2004
- Published online by Cambridge University Press:
- 01 February 2011, Q3.4
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- 2004
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Unexpected Mode of Plastic Deformation in Cu Damascene Lines Undergoing Electromigration
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- Journal:
- MRS Online Proceedings Library Archive / Volume 812 / 2004
- Published online by Cambridge University Press:
- 17 March 2011, F7.3
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- 2004
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Size Effect on Crack Formation in Cu/Ta and Ta/Cu/Ta Thin Film Systems
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- Journal:
- MRS Online Proceedings Library Archive / Volume 821 / 2004
- Published online by Cambridge University Press:
- 15 March 2011, P2.7
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- 2004
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Coupling Between Precipitation and Plastic Deformation During Electromigration in a Passivated Al (0.5wt%Cu) Interconnect
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- Journal:
- MRS Online Proceedings Library Archive / Volume 812 / 2004
- Published online by Cambridge University Press:
- 17 March 2011, F7.4
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- 2004
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Quantitative Characterization of Dislocation Structure coupled with Electromigration in a Passivated Al (0.5wt%Cu) Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 766 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, E1.2
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- 2003
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Spatially Resolved Characterization of Electromigration-Induced Plastic Deformation in al (0.5WT% CU) Interconnect
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- Journal:
- MRS Online Proceedings Library Archive / Volume 738 / 2002
- Published online by Cambridge University Press:
- 11 February 2011, G13.1
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- 2002
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“Reverse” Stress Relaxation in cu Thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 673 / 2001
- Published online by Cambridge University Press:
- 18 March 2011, P1.4
- Print publication:
- 2001
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Local Microstructure and Stress in Al(Cu) Thin Film Structures Studied by X-Ray Microdiffraction
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- Journal:
- MRS Online Proceedings Library Archive / Volume 673 / 2001
- Published online by Cambridge University Press:
- 18 March 2011, P7.7
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- 2001
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Microtexture and Strain in Electroplated Copper Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D10.3.1
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- 2000
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Grain Orientation and Strain Measurements in Sub-Micron wide Passivated Individual Aluminum Test Structures
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D8.8.1
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- 2000
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Mechanical Properties of Electroplated Copper Thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 594 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 63
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- 1999
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Copper Versus Magnesium as an Alloying Element in Aluminum Interconnects: Effects on Electromigration
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- Journal:
- MRS Online Proceedings Library Archive / Volume 516 / January 1998
- Published online by Cambridge University Press:
- 10 February 2011, 269
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- January 1998
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Evolution of the Optical Response from a Very Narrow Gap Semiconductor to a Metallic Material in (FexMn1−x)Si
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- Journal:
- MRS Online Proceedings Library Archive / Volume 402 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 361
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- 1995
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