The effects of curing rate and solvent content prior to curing were examined for Hitachi PIX L110 polyimide thin films. DMA, TMA, DSC, and wafer bow measurements were used to elucidate in-plane storage modulus, Z-axis CTE, heat capacity, and residual stress dependencies on processing conditions and film position across the wafer. It was found that the residual stress and storage modulus are highly dependent on the processing conditions. Additionally, the heat capacity and storage modulus showed significant dependency on wafer position as well as processing conditions. The Z-axis CTE was found to deviate significantly from values published for the in-plane (xy) direction.