Micromachining has potential applications for large area image sensors and displays, but conventional MEMS technology, based on crystalline silicon wafers cannot be used. Instead, large area devices use deposited films on glass substrates. This presents many challenges for MEMS, both as regards materials for micro-machined structures and the integration with large area electronic devices. We are exploring the novel thick photoresist SU-8, as well as plating techniques for the fabrication of large area MEMS. As an example of its application, we have applied this MEMS technology to improve the performance of an amorphous silicon based image sensor array. SU-8 is explored as the structural material for the X-ray conversion screen and as a thick interlayer dielectric for the thin film readout electronics of the imager.