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Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias and Re-distribution for 3D System-in-Package Integration
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- Journal:
- MRS Online Proceedings Library Archive / Volume 970 / 2006
- Published online by Cambridge University Press:
- 26 February 2011, 0970-Y05-04
- Print publication:
- 2006
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- Article
- Export citation