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Evaluation of the Chemical-mechanical Planarization (CMP) Performance of Silicon Nitride and Silicon Carbide as Hard Mask Materials for Cu-based Interconnect Technology
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- Journal:
- MRS Online Proceedings Library Archive / Volume 732 / 2002
- Published online by Cambridge University Press:
- 01 February 2011, I1.7
- Print publication:
- 2002
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- Article
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