2 results
Effect of Via Etch Profile and Barrier Metal on Electromigration Performance of W-Filled Via Structure in TiN/AlCu/TiN Metallization
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 391 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 453
- Print publication:
- 1995
-
- Article
- Export citation
Simulation Studies of TiN PVD and CVD Thin Films for Contact/Via Liners
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 389 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 173
- Print publication:
- 1995
-
- Article
- Export citation