5 results
3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1112 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1112-E02-01
- Print publication:
- 2008
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Platinum Nanostructure Growth Using Self-Assembled Fluorocarbon Structure
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1017 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 1017-DD12-27
- Print publication:
- 2007
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Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F10-05
- Print publication:
- 2006
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Damascene-Patterned Metal-Adhesive (Cu-BCB) Redistribution Layers
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- Journal:
- MRS Online Proceedings Library Archive / Volume 970 / 2006
- Published online by Cambridge University Press:
- 26 February 2011, 0970-Y04-02
- Print publication:
- 2006
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Low-Temperature PETEOS-to-PETEOS Wafer Bonding Using Titanium as Bonding Intermediate
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F03-15
- Print publication:
- 2006
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- Article
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