Spin-on Low-K materials are potentially very attractive as interconnection
materials in a wide range of semiconductor structures. In this work, new
organic-inorganic hybrid materials synthesized by vinylsilane polymerization
were proposed. According to compositions and additional fabrications,
dielectric constants of these materials were evaluated to be 2.3∼3.1. The
hardness was 2.0GPa after 430°C curing. These materials had good adhesion
strength such that fracture toughness on silicon wafer was 0.22
MPam0.5 without any adhesion promoters. This result indicates
that these organicinorganic hybrid materials are very promising candidates
for low-K dielectrics.