2 results
Microbump Impact on Reliability and Performance in Through-Silicon Via Stacks
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1335 / 2011
- Published online by Cambridge University Press:
- 10 August 2011, mrss11-1335-o08-05
- Print publication:
- 2011
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- Article
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Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-F09-08
- Print publication:
- 2010
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- Article
- Export citation