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Effect of Via Etch Profile and Barrier Metal on Electromigration Performance of W-Filled Via Structure in TiN/AlCu/TiN Metallization
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- Journal:
- MRS Online Proceedings Library Archive / Volume 391 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 453
- Print publication:
- 1995
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- Article
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